Patents Assigned to RBP Chemical Corporation
  • Composition for stripping lead-tin solder
    Patent number: 3990982
    Abstract: A method for rapidly stripping solder or tin from a substrate, such as copper, without adversely affecting the substrate in the preparation of circuit boards having terminal tabs. The composition comprises hydrofluoric acid or salts thereof, ammonia and an oxygen source such as hydrogen peroxide. The use of a soluble metal complexer peroxide stabilizer enables use of larger percentages of fluoride and peroxide to materially increase the life and capacity of the product. The composition is especially useful in a process of rapidly stripping solder from copper terminal tabs of a printed circuit board, following which the exposed copper tab is plated with a more noble metal.
    Type: Grant
    Filed: October 24, 1975
    Date of Patent: November 9, 1976
    Assignee: RBP Chemical Corporation
    Inventor: Charles H. Dixon
  • Method of preparing printed circuit boards with terminal tabs
    Patent number: RE29181
    Abstract: A method for rapidly stripping solder or tin from a substrate, such as copper, without adversely affecting the substrate in the preparation of circuit boards having terminal tabs. The composition comprises hydrofluoric acid or salts thereof, ammonia and an oxygen source such as hydrogen peroxide. The use of a soluble metal complexer peroxide stabilizer enables use of larger percentages of fluoride and peroxide to materially increase the life and capacity of the product. The composition is especially useful in a process of rapidly stripping solder from copper terminal tabs of a printed circuit board, following which the exposed copper tab is plated with a more noble metal.
    Type: Grant
    Filed: June 4, 1976
    Date of Patent: April 12, 1977
    Assignee: RBP Chemical Corporation
    Inventor: Charles H. Dixon, III