Patents Assigned to RCD Technology Corp.
  • Publication number: 20080297317
    Abstract: A game can comprise a board with multiple RFID antennas and a game piece with a RFID antenna. When one of the multiple RFID antennas is adjacent to the RFID antenna in the game piece, the response characteristics of these RFID antennas can change so that the position of the game piece can be determined.
    Type: Application
    Filed: April 17, 2008
    Publication date: December 4, 2008
    Applicant: RCD Technology Corp.
    Inventor: Robert R. Oberle
  • Publication number: 20070125867
    Abstract: A tamper evident RFID circuit uses a fold section that forms a capacitive element when folded together.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 7, 2007
    Applicant: RCD Technology Corp.
    Inventor: Robert Oberle
  • Publication number: 20060205113
    Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
    Type: Application
    Filed: March 14, 2005
    Publication date: September 14, 2006
    Applicant: RCD Technology Corp.
    Inventor: Robert Oberle
  • Publication number: 20060205115
    Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
    Type: Application
    Filed: November 22, 2005
    Publication date: September 14, 2006
    Applicant: RCD Technology Corp.
    Inventor: Robert Oberle
  • Publication number: 20060028379
    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
    Type: Application
    Filed: August 11, 2005
    Publication date: February 9, 2006
    Applicant: RCD Technology Corp.
    Inventor: Robert Oberle
  • Publication number: 20050253772
    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
    Type: Application
    Filed: July 26, 2005
    Publication date: November 17, 2005
    Applicant: RCD Technology Corp.
    Inventor: Robert Oberle
  • Patent number: 6933892
    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: August 23, 2005
    Assignee: RCD Technology Corp.
    Inventor: Robert R. Oberle