Patents Assigned to RCD Technology Inc.
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Patent number: 7916028Abstract: Moving a mobile RFID reader with an area in a systemic manner to do non-inventory tasks, while doing the non-inventory tasks, integrating RFID tags associated with inventory, and updating a database with the inventory information obtained from the RFID tags.Type: GrantFiled: June 2, 2008Date of Patent: March 29, 2011Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7884719Abstract: An antenna web can include an RFID antenna on a first side of a substrate. An adhesive can be laminated on a second side of the substrate. The antenna web can then be cut into individual segments for use in constructing an RFID label.Type: GrantFiled: September 11, 2007Date of Patent: February 8, 2011Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7859415Abstract: A RFID-based identification device comprising a first RFID antenna; and a second RFID antenna, wherein the first and second RFID antennas are in a first arrangement, the resonant frequencies of the antennas are away from an interrogation frequency such that no identification information is transferred, and wherein when the first and second RFID antennas are in a second arrangement, the resonant frequency of the identification device shifts such that identification information is transferred.Type: GrantFiled: June 2, 2008Date of Patent: December 28, 2010Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7791483Abstract: A game can comprise a board with multiple RFID antennas and a game piece with a RFID antenna. When one of the multiple RFID antennas is adjacent to the RFID antenna in the game piece, the response characteristics of these RFID antennas can change so that the position of the game piece can be determined.Type: GrantFiled: April 17, 2008Date of Patent: September 7, 2010Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7674649Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.Type: GrantFiled: August 6, 2008Date of Patent: March 9, 2010Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7639184Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: GrantFiled: July 26, 2005Date of Patent: December 29, 2009Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7589419Abstract: An RFID chip can have an RFID circuit having first and second initial bond pads and conductive paths on the RFID chip connecting the first and second bond pads to the different sides of the chip. The conductive paths including a first side connector on a first side of the chip electrically connected to the first bond pad and a second side connector on a second side of the chip connected to the second bond pad. The first and second side connectors can cover at least half of the first and second side length respectively.Type: GrantFiled: August 1, 2007Date of Patent: September 15, 2009Assignee: RCD Technology, Inc.Inventor: Robert R. Oberle
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Publication number: 20090128295Abstract: A RFID-based identification device comprising a first RFID antenna; and a second RFID antenna, wherein the first and second RFID antennas are in a first arrangement, the resonant frequencies of the antennas are away from an interrogation frequency such that no identification information is transferred, and wherein when the first and second RFID antennas are in a second arrangement, the resonant frequency of the identification device shifts such that identification information is transferred.Type: ApplicationFiled: June 2, 2008Publication date: May 21, 2009Applicant: RCD Technology, Inc.Inventor: Robert R. Oberle
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Patent number: 7515116Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: GrantFiled: August 10, 2007Date of Patent: April 7, 2009Assignee: RCD Technology, Inc.Inventor: Robert R. Oberle
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Patent number: 7456752Abstract: A sensor can detect the presence of fluid by the changing of the response characteristics of an RLC circuit. A window in the sensor is used to position a short caused by the fluid.Type: GrantFiled: May 5, 2004Date of Patent: November 25, 2008Assignee: RCD Technology, Inc.Inventor: Robert R. Oberle
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Patent number: 7456506Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.Type: GrantFiled: November 22, 2005Date of Patent: November 25, 2008Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Patent number: 7388542Abstract: A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.Type: GrantFiled: November 10, 2005Date of Patent: June 17, 2008Assignee: RCD Technology, Inc.Inventors: Sandra M. Garby, Robert R. Oberle
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Patent number: 7377447Abstract: A tamper evident RFID circuit uses a fold section that forms a capacitive element when folded together.Type: GrantFiled: December 5, 2005Date of Patent: May 27, 2008Assignee: RCD Technology, Inc.Inventor: Robert R. Oberle
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Patent number: 7298331Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: GrantFiled: August 11, 2005Date of Patent: November 20, 2007Assignee: RCD Technology, Inc.Inventor: Robert R. Oberly
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Patent number: 7268740Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: GrantFiled: August 24, 2004Date of Patent: September 11, 2007Assignee: RCD Technology Inc.Inventor: Robert R. Oberle
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Publication number: 20050078035Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.Type: ApplicationFiled: August 24, 2004Publication date: April 14, 2005Applicant: RCD Technology, Inc.Inventor: Robert Oberle
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Publication number: 20050017727Abstract: A sensor can detect the presence of fluid by the changing of the response characteristics of an RLC circuit. A window in the sensor is used to position a short caused by the fluid.Type: ApplicationFiled: May 5, 2004Publication date: January 27, 2005Applicant: RCD Technology, Inc.Inventor: Robert Oberle