Abstract: The assembly comprises a casing and a PC-Board in sheet form arranged therein, having a comb-spring and projecting freely into a recess of the wall of the casing. The lower face of the PC-board is furnished with a set of conductive pathways leading to microchips to be connected to an independent electric system by bending the PC-board sheet so as to make contact with a second set of homologous conductive pathways belonging to said system. This bending is obtained by displacing a shoe pushing a cylindrical bar freely engaged in a slot of the wall of the casing in communication with the recess, the bar lying on the structure formed by the combining and the PC-board sheet.The electrical contact between both sets of conductive pathways can be interrupted by moving the shoe axially in a first direction corresponding to the bending of the PC-board sheet; a motion of the shoe in a second opposite direction re-establishes the electrical contact conditions of both sets of pathways.
Abstract: The device consists of two superimposed substrates (1 and 5) each carrying a grid of orthogonal conductive tracks (2 and so forth) facing each other from grid to grid and kept at a distance from each other by spacing rods (4). The tracks of each grid are attached to linear resistances (R.sub.AX and R.sub.AY) designed to be simultaneously connected, one to a direct-current reference potential and the other to a potential sensor, and conversely. This sensor can thus receive analog signals which are characteristic of the position of any point on the substrate (5) which is formed by a soft membrane, on which substrate a pressure is exerted which puts at least one track (6) of the grid associated with this substrate (5) into contact with one track (2) belonging to the grid associated with the other substrate (1).