Abstract: An inverse type compound thin film magnetic with good dispersion of the heat generated in the magnetoresistance (MR) element, ensuring thermal reliability. In one embodiment, an electromagnetic induction type thin film magnetic head, a magnetoresistance effect type thin film magnetic head, a first protective film, a heat dispersion layer with thermal conductivity higher than the first protective film, and a second protective film are formed in succession on a substrate.

Abstract: A spin-valve magnetic resistance sensor. In one embodiment, the spin-valve magnetic resistance sensor includes a pair of ferromagnetic layers with a non-magnetic layer sandwiched in between. The pair of ferromagnetic layers, the non-magnetic layer and an antiferromagnetic layer are laminated on a substrate. The antiferromagnetic layer is formed using an antiferromagnetic material which uses a Pt—Mn—X alloy, Ir—Mn—X alloy, Rh—Mn—X alloy, Ru—Mn—X alloy or Pd—Mn—X alloy. X indicates one or more elements selected from a set consisting of elements of groups IIA, IVA, VA, IIIB and IVB of the periodic table. X is in the range of 0.1 at % to 15 at %.

Abstract: A magnetic head manufacturing method. In one embodiment, a wafer including magnetic head devices formed on the surface thereof are cut out into individual sliders. Photoresist is applied on the air bearing surfaces of the sliders and is then baked. The surface tension causes the photoresist at the peripheral regions of the air bearing surface to taper and become rounded or thinned. The air bearing surface is then uniformly dry-etched such that the peripheral regions of the air bearing surface are rounded in a tapered shape.