Abstract: A spin-valve magnetic transducing element. In one embodiment, a spin-valve magnetic transducing element is disclosed in which a ferromagnetic tunneling junction film, including first and second ferromagnetic layers and an insulating layer is enclosed between the ferromagnetic layers. A nonmagnetic metal thin film is inserted between the second ferromagnetic layer and the insulating layer, all of which are formed on a substrate.

Abstract: A method of manufacturing a thin film magnetic head includes forming a recording gap layer of a non-alumina base nonmagnetic material on a lower magnetic pole layer, the lower magnetic pole layer being composed of materials that are milled at the same rate. An upper magnetic pole layer is formed on the recording gap layer, and a single piece of equipment is used to trim the lower magnetic pole layer and pattern the recording magnetic gap layer such that the lower magnetic pole layer has a width that is substantially the same as that of the upper magnetic pole layer. The recording gap layer and the upper and lower half-gap layers are then removed over a region of the underlying substrate. Prescribed areas of tan air-bearing surface (ABS) are then etched to form a slider shape having a protruding part and a depressed part, the ABS and the side surface having a common edge such that the depressed part along the common edge extends into, but not beyond, the region.

Abstract: A magnetic transducing element in which a ferromagnetic tunneling junction film, including first and second ferromagnetic layers and an insulating layer are enclosed between the ferromagnetic layers, and a nonmagnetic metal thin film is inserted between the second ferromagnetic layer and the insulating layer, is formed on a substrate.

Abstract: A thin-film magnetic head in which has a spin-valve element and a pair of electrode layers that are electrically connected to both ends of the element in the direction of width. A tantalum film is laminated as a protective layer on the uppermost part of the abovementioned element. A pair of electrode layers are caused to overlap on both end portions of the element. The tantalum oxide present in the areas on which the electrode layers overlap is removed prior to the formation of the electrode layers so that the electrical resistance between the electrode layers and the element is reduced.

Abstract: A magnetic transducing element in which a ferromagnetic tunneling junction film, including first and second ferromagnetic layers and an insulating layer are enclosed between the ferromagnetic layers, and a nonmagnetic metal thin film is inserted between the second ferromagnetic layer and the insulating layer, is formed on a substrate.

Abstract: Prevention of the formation of unwanted profiles in the ABS surface by etching of the slider ABS surface, even when gap layers are formed from non-alumina-base nonmagnetic materials differing from the component material of the substrate. Numerous thin film magnetic head elements, consisting of multiple layers including magnetic gap layers composed of nonmagnetic materials, are formed in a lattice array on the surface of a wafer. In the process of formation of these elements, the component materials of the magnetic gap layers existing in the region to be etched in order to form the slider shape are removed in advance. The wafer on the surface of which the elements are formed is cut into individual head blocks, and the surfaces opposing the magnetic recording media, consisting of a cut surface of said head block, are formed into a slider shape by etching.

Abstract: A compound thin film magnetic head in which the upper shield of the readout MR head also serves as the lower magnetic film of the write inductive head. The upper shield has a layered structure including a shield part of soft magnetic material functioning as a shield to magnetically shield the MR head, a lower pole part and transition part of soft magnetic material functioning as a write magnetic pole opposing the upper pole of the inductive head, and a nonmagnetic separation layer to magnetically separate these. Between the lower pole part and the transition part, an additional nonmagnetic separation layer can be provided. The shield part can be configured from multiple magnetic films formed in layers and enclosing a nonmagnetic separation layer.

Abstract: A composite type thin-film magnetic head. In one embodiment, a projection is formed on a second magnetic film layer of a composite type thin-film magnetic head. The position where this projection is formed is the area where a second magnetic film layer and third magnetic film layer face each other across a gap film layer. A width b of the projection is smaller than a width a of the third magnetic layer film.

Abstract: A method of forming an oxide film over the substrate of an electronic device. In one embodiment, a first metal oxide film layer is deposited on the substrate of the electronic device by bias sputtering. Then, a second metal oxide film layer is deposited by ion beam sputtering on the first metal oxide film layer. In another embodiment, a first metal oxide film layer is deposited on the substrate of the electronic device by ion beam sputtering. Then, a second metal oxide film layer is deposited by bias sputtering on the first metal oxide film layer. In yet another embodiment, a first metal oxide film layer having a first degree of purity is deposited on the substrate of the electronic device. Then, a second metal oxide film layer having a second degree of purity is deposited on the first metal oxide film layer. The first degree of purity is different than the second degree of purity.

Abstract: A composite type thin-film magnetic head. In one embodiment, a substrate is used as a base, and an insulating film, a lower shielding magnetic film, a magneto-resistive element, an upper shielding magnetic film, a magnetic gap film, a recording inductive magnetic film and a protective layer are laminated on this base. An inductive head used for recording is formed by the upper shielding magnetic film. A magnetic gap film, a recording inductive magnetic film, and a magneto-resistive head used for playback are formed by the magneto-resistive element. The upper shielding magnetic film and recording inductive magnetic film are formed by an electroplating of permalloy. The upper shielding magnetic film has a lower nickel concentration on the side of the magnetic gap film than on the side of the magneto-resistive element.

Abstract: An inductive/MR composite type thin film magnetic head which realizes high speed, high density recording while at the same time preventing the occurrence of read-out error by reducing NLTS.

Abstract: A magnetic thin film manufacturing method in which an object of treatment is electroplated in a plating bath so that a magnetic thin film is formed on the surface of the object of treatment. The plating bath contains two or more types of ions selected from a set consisting of Fe.sup.2+ ions, Ni.sup.2+ ions and Co.sup.2+ ions, and fine particles of an insulating material are dispersed in the plating bath. In a more particular embodiment of the invention, a magnetic thin film manufacturing method is characterized by the fact that ?a! the aforementioned two or more types of ions selected from a set consisting of Fe.sup.2+ ions, Ni.sup.2+ ions and Co.sup.2+ ions are supplied by means of sulfates and/or chlorides, ?b! the plating bath is an acidic bath, and ?c! the fine particles of an insulating material that are dispersed in the plating bath are colloidal particles of SiO.sub.2 and/or Al.sub.2 O.sub.3.

Abstract: The object of the present invention is to improve the bonding characteristics and peeling resistance of the insulating film formed on the substrate of a thin-film magnetic head.An insulating film consisting of Al.sub.2 O.sub.3 is formed by sputtering on the surface of an ALTIC substrate in which numerous recesses and projections (in which the projecting portions consist of TiC) have been formed by selectively removing the alumina portions of said substrate by etching using an RIE process. An electromagnetic transducer element circuit is then laminated on the surface of said insulating film.Since the contact area between the substrate surface and the insulating layer is increased, and especially since the contact area between the TiC and the Al.sub.2 O.sub.3 is increased due to the projection of the TiC, the bonding force between the two films is increased, and the resistance to peeling is conspicuously improved.