Abstract: The surface recombination velocity of a silicon sample is reduced by deposition of a thin hydrogenated amorphous silicon or hydrogenated amorphous silicon carbide film, followed by deposition of a thin hydrogenated silicon nitride film. The surface recombination velocity is further decreased by a subsequent anneal. Silicon solar cell structures using this new method for efficient reduction of the surface recombination velocity is claimed.
Type:
Application
Filed:
November 14, 2014
Publication date:
March 12, 2015
Applicants:
REC SOLAR PTE, LTD., INSTITUTT FOR ENERGITEKNIKK, UNIVERSITETET I OSLO
Inventors:
Alexander ULYASHIN, Andreas BENTZEN, Bengt SVENSSON, Arve HOLT, Erik SAUAR
Abstract: The surface recombination velocity of a silicon sample is reduced by deposition of a thin hydrogenated amorphous silicon or hydrogenated amorphous silicon carbide film, followed by deposition of a thin hydrogenated silicon nitride film. The surface recombination velocity is further decreased by a subsequent anneal. Silicon solar cell structures using this new method for efficient reduction of the surface recombination velocity is claimed.
Type:
Grant
Filed:
April 12, 2006
Date of Patent:
December 23, 2014
Assignees:
Rec Solar Pte. Ltd., Universitetet I Oslo, Instititt for Energiteknikk
Inventors:
Alexander Ulyashin, Andreas Bentzen, Bengt Svensson, Arve Holt, Erik Sauar
Abstract: The present invention relates to cost effective production methods of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.
Type:
Grant
Filed:
September 28, 2012
Date of Patent:
October 14, 2014
Assignee:
Rec Solar Pte. Ltd.
Inventors:
Richard Hamilton Sewell, Andreas Bentzen
Abstract: This invention relates to a method for producing solar cells, and photovoltaic panels thereof. The method for producing solar panels comprises employing a number of semiconductor wafers and/or semiconductor sheets of films prefabricated to prepare them for back side metallization, which are placed and attached adjacent to each other and with their front side facing downwards onto the back side of the front glass, before subsequent processing that includes depositing at least one metal layer covering the entire front glass including the back side of the attached wafers/sheets of films. The metallic layer is then patterned/divided into electrically isolated contacts for each solar cell and into interconnections between adjacent solar cells.
Type:
Application
Filed:
May 2, 2014
Publication date:
August 28, 2014
Applicant:
REC SOLAR PTE. LTD.
Inventors:
Martin NESE, Erik SAUAR, Andreas BENTZEN, Paul Alan BASORE
Abstract: The present invention relates to cost effective methods for metallization and or metallization and interconnection of high efficiency silicon based back-contacted back-junction solar panels and solar panels thereof having a multiplicity of alternating rectangular emitter- and base regions on the back-side of each cell, each with rectangular metallic electric finger conductor above and running in parallel with the corresponding emitter- and base region, a first insulation layer in-between the wafer and finger conductors, and a second insulation layer in between the finger conductors and cell interconnections.
Type:
Grant
Filed:
September 28, 2012
Date of Patent:
July 1, 2014
Assignee:
Rec Solar Pte. Ltd.
Inventors:
Richard Hamilton Sewell, Alan Francis Lyon, Andreas Bentzen
Abstract: This invention relates to a method for producing solar cells, and photovoltaic panels thereof. The method for producing solar panels comprises employing a number of semiconductor wafers and/or semiconductor sheets of films prefabricated to prepare them for back side metallization, which are placed and attached adjacent to each other and with their front side facing downwards onto the back side of the front glass, before subsequent processing that includes depositing at least one metal layer covering the entire front glass including the back side of the attached wafers/sheets of films. The metallic layer is then patterned/divided into electrically isolated contacts for each solar cell and into interconnections between adjacent solar cells.
Type:
Grant
Filed:
April 2, 2009
Date of Patent:
June 17, 2014
Assignee:
Rec Solar Pte. Ltd.
Inventors:
Martin Nese, Erik Sauar, Andreas Bentzen, Paul Alan Basore