Abstract: A device (12) picks up at least one semi-conductor wafer (11) from a container (14) of wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant. The device is on the opposite side (17) of the aperture and the pick-up is effected through it. The device incorporates a shutter (1) movable between open and closed positions. A wafer picking up means (2) is attached to the shutter and is designed to enter partially within the container below a wafer and seize the wafer by its edge. A pick up moving means (3) moves the picking up means (2) back and forth through the aperture (13).

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: A device and process are provided for identifying characters inscribed on a semiconductor wafer containing an orientation mark. A semiconductor wafer having characters inscribed on a surface near its periphery is supported about its periphery between three rotary supports mounted on a grasping arm. An orientation mark on the periphery of the wafer is located adjacent the inscribed characters. At least one of the three rotary supports is rotatably driven to orient the wafer such that the orientation mark is placed in a determined position. An optical reflector is positioned in a spatial zone in proximity to and above the characters to be identified. The characters to be identified are illuminated by a light beam reflected by the optical reflector. The characters reflect the light, which may be observed by an optical imager, such as a camera. An optical recognition subsystem may then be used to identify the characters.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: A device (12) to pick up at least one disc-shaped semi-conductor wafer (11) from a container (14) of such wafers fitted on one side (15) of an aperture (13) in the transfer station (10) of a semi-conductor wafer processing plant, the device being situated on the opposite side (17) of the said aperture and the pick-up being effected through it. The device incorporates: A moving shutter (1) designed to move between a first, closed aperture, position and a second, open aperture, position that allows access to the inside of the container. A means of moving (18) this shutter between these first and second positions, the said movement taking place, at least in part, in a plane approximately parallel to the plane of the aperture.

Abstract: Embodiments of the invention are directed to substrate processing apparatuses and methods for processing substrates. In one embodiment, a substrate processing apparatus includes a processing chamber, a substrate holder inside of the processing chamber for holding a substrate, and a sonic box in the processing chamber for supplying sonic waves substantially perpendicularly to the substrate. The sonic box may comprises a membrane, and a transducer coupled to the membrane.

Abstract: A system for conveying and storing wafer containers in connection with wafer processing tools arranged in a row of a wafer fabrication facility and having substantially vertical faces in a common plane with wafer loading/unloading openings associated therewith includes a wafer container storage area, a wafer container temporary support, and a wafer container transfer mechanism. A row conveyor conveys wafer containers to the row. The wafer container transfer mechanism is located rearwardly of the vertical faces of the tools and the wafer container storage area, which has a plurality of stacked shelves, is located reawardly of the faces and above the tools in a subframe. The wafer container temporary support protrudes from the front of the faces. A wafer container transfer mechanism drive moves the wafer container transfer mechanism in X, Y, and Z directions in order to access the container storage area, the wafer container temporary support, and the openings of the tools.

Abstract: The object of this invention relates to the technical sector of microelectronics.The vacuum handling system according to the invention comprises a hollow body (1) of which the end takes the gripping tip forming an inside chamber (1b) with at least two annular grooves (1b1) and (1b2) for the positioning of two O rings (7) of a soft deformable material to insure, on the one hand the dismantable assembling of the part corresponding to the tip, and, on the other hand, the vacuum tightness.

Abstract: The object of the invention relates to the technical sector of microelectronics. According to the process, one starts off with a hollow stainless steel tube (1) of determined diameter; the tube (1) is shrunk for a certain length (1a) and flattened, the remaining part is flattened to form two opposite flat non close joining faces (1b) and (1c); a slot (1b1) is machined in one of the flattened faces (1b) and a hole (1c1) in the other face (1c); a blade (2) provided with an axial notch (2a) on one of its edges is inserted between the two faces (1b) and (1c); through the hole (1c1) formed in one of the faces, a powder is inserted, designed to carry out microbrazing after heating; the assembly is placed in to a furnace to insure bracing of the blade (2) with the flattened parts and simultaneously filling by microbrazing remaining cavities between the blades and the flattened parts; the ends of the flattened gripping parts are rounded off; the flattened gripping areas are ground.

Abstract: The device according to this invention comprises a casing in which turns a device designed to support and hold the wafer, the said device is fitted eccentrically with respect to its rotational pin (3) a support element 5-6 designed to hold the silicon wafer by its edges in a horizontal plane, the device assembly being mounted in stable balance with respect to the said pin.