Patents Assigned to Redpoint Thermalloy Limited
  • Patent number: 5903977
    Abstract: Heatsink devices are formed by attaching a plurality of fin members to a planar base member. A primary strip of thermally conducive material forms base members which are assembled with fin members formed from a secondary sheet of thermally conducting material. Each fin member is secured to a respective portion of the primary strip. The primary strip is advanced with the fin members secured thereto to be parted off to provide the heatsink devices. The synchronization of the forming of fins with the assembly reduces manual input to the manufacturing process, negates the need to hold stocks of preformed fins and increases design freedom with respect to dimensions of the heatsinks being formed.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: May 18, 1999
    Assignee: Redpoint Thermalloy Limited
    Inventors: Francis E. Fisher, Robin D. Johnson
  • Patent number: 5774964
    Abstract: A process for forming a profiled element from a generally longitudinally extending extruded sheet-form member having a plurality of transversely spaced longitudinally extended ribs upstanding therefrom is provided. The process includes the step of removing longitudinally spaced apart portions from some of said ribs by means of a transversely acting punching means.
    Type: Grant
    Filed: April 20, 1995
    Date of Patent: July 7, 1998
    Assignee: Redpoint Thermalloy, Limited
    Inventors: Francis Edward Fisher, Robin Douglas Johnson, David George Gove, Michael Dennis Wade
  • Patent number: 5422789
    Abstract: A sheet metal device for mounting a component on a circuit board is formed by stamping to defining a head portion and a base portion. The head portion is formed for insertion into a slot in a component such as a heat sink and the base portion is formed for insertion into a printed circuit board. The head portion has spade-form members which engage the walls of the slot and retain the head portion in the slot. The component is mounted on a printed circuit board by inserting the base portion into an aperture in the printed circuit board and soldering the base portion to the reverse surface of the board.
    Type: Grant
    Filed: November 2, 1993
    Date of Patent: June 6, 1995
    Assignee: Redpoint Thermalloy Limited
    Inventors: Francis E. Fisher, Robin D. Johnson, William D. Jordan