Abstract: There is described a line card rack assembly for line cards, and an optical backplane and optical fiber guide for installation to a frame adapted to receive line cards of which at least one has an optical connector at a front portion thereof. The rack assembly comprises a frame having a front opening, for receiving the line cards and providing access to a front end of the line cards, and a back opening opposite the front opening; an optical backplane at least partially covering the back opening, the optical backplane comprising connections for connecting the line cards upon insertion in the frame; and optical fiber cable having two ends, a first one of the two ends being for coupling to the optical backplane, and a second one of the two ends for coupling to the optical connector of the at least one of the line cards.

Abstract: The present document describes an optical interconnect module for interfacing optical fibers. An optical interconnect module in accordance with an embodiment comprises a casing including a projection and an optical sub-assembly including an interlock portion for receiving the projection of the casing. The optical sub-assembly carries a plurality of optical fibers, and couples face to face with an optical cable assembly for aligning the corresponding fibers together. The optical cable assembly is usually provided in an optical cable connector, along with a spring which compresses when the optical cable connector is inserted in the optical interconnect module. The pressure provided by the spring is transmitted to the optical sub-assembly. The optical sub-assembly applies this pressure to the projection received in the notch thereof for maintaining a tight engagement with the optical cable assembly.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.

Abstract: There is described an opto-electronic Integrated Circuit Board (ICB) comprising an ICB substrate; a linear array of cells positioned on the ICB substrate, for optical connection to an array of optical fibers, each one of the cells comprising: a die bond pad and one of a Vertical Cavity Surface Emitting Laser (VCSEL) and a Photodetector; a number of ICB bond pads on the ICB substrate, the number of ICB bond pads corresponding at least to a number of cells in the linear array, wherein each successive ICB bond pad along the linear array is located on alternate sides of the linear array; and wirebonds each connecting, in a one-to-one relationship, each one of the ICB bond pads to a corresponding die bond pad of one of the cells of the linear array.

Abstract: An optically-enabled integrated circuit (IC) package for connecting an electrical circuit board to an optical fiber is presented. The IC package comprises an OSA having a laser which is pre-aligned with the optical fiber. The OSA further comprises a standard electrical interface for the connection to the microchip and a standard optical interface for the connection to the optical fiber. A set of mechanical concepts for connecting optical connectors and cables to integrated circuit packages is also presented and can be applied for any type of optical connector such as single optical fiber ferrules, MT-RJ type optical ferrules and 2-D MT-type optical ferrules.

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: A method and apparatus is disclosed for enabling a coupling of at least one optical fiber with an optoelectronic device. The apparatus comprises at least one v-groove for receiving at least one optical fiber. A first end of the apparatus is then polished at a predetermined angle in order to enable an optical coupling with the optoelectronic device.

Abstract: There is provided an optical assembly and a method for assembling components of the optical assembly, the method comprising: providing a structure for guiding light; providing a plurality of optical fibers embedded in a fixed arrangement in the structure, the optical fibers for coupling the light from a coupling surface the structure; abutting a first package against the coupling surface, such that each one of multiple elements comprised in the first package is substantially aligned with each one of a first group of optical fibers in the plurality of optical fibers; and abutting a second package against the coupling surface, adjacent to the first package, and such that: the first and the second package are spaced apart by a gap; and each one of multiple elements comprised in the second package is substantially aligned with each one of a second group of optical fibers in the plurality of optical fibers, the gap providing a tolerance in a position of any one of: each one of the elements in the packages; the pac

Abstract: The present invention provides a self-contained optical hybrid IC (OHIC) package for optical side-coupling to an optical waveguide of a printed wiring board (PWB). The OHIC package comprises an integrated circuit (IC) package. It also comprises a self-contained optical subassembly (OSA) having an optical coupling facet and being adapted to be bonded to the integrated circuit (IC) package, wherein the OSA comprises an optoelectronic device and an optical channel, the optoelectronic device being optically coupled to the optical channel, the optical channel relaying light between the optoelectronic device and the optical coupling facet, wherein the OSA is mechanically and electrically bonded to the IC package to thereby provide an electrical coupling between the optoelectronic device and the IC package and enable the optical side-coupling to the optical waveguide via the optical coupling facet. The invention also provides a method for creating the OHIC package.

Abstract: An optical connector and a manufacturing method are disclosed. The method for manufacturing an optical connector achieving a mechanical coupling comprises embedding a length of at least one optical fiber in a body to form an assembly. It also comprises to remove, at a first end of the assembly, a portion to provide a beveled surface on a corresponding first end of the optical fiber at which light is reflected for a side coupling. Also, at a portion of a side of the assembly near the first end, the method comprises creating an optical surface to provide a flat coupling surface for said side coupling. The method also comprises removing, at a second end of the assembly, a portion to provide a flat abutment surface including a corresponding second end of the at least one optical fiber. The method also comprises providing at the second end of the assembly a mating structure for precision connecting with a complementary connector in which an optical waveguide is end-coupled with at least one of the optical fiber.

Abstract: A method for providing an encapsulated optoelectronic chip is provided. The optoelectronic chip is secured on a substrate. A translucent coating substance is then applied on said optoelectronic chip and the translucent coating substance is then polished away to enable an optical coupling.