Patents Assigned to Rehm Anlagenbau GmbH
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Publication number: 20090188967Abstract: A method is provided for a soldering process. The method can include receiving a liquid phase heat transfer medium at a preheating container. The heat transfer medium can be received from an external supply. The method can also include heating the heat transfer medium to or above a predefined temperature that maintains the liquid phase and directing the heated heat transfer medium from the preheating container to an evaporation container. In the evaporation container, the heat transfer medium can be vaporized to convert the heat transfer medium from the liquid phase to a gas phase. Further, the method can include directing the gas phase heat transfer medium from the evaporation container to a solder chamber. The soldering process occurs in the solder chamber.Type: ApplicationFiled: April 3, 2009Publication date: July 30, 2009Applicant: Rehm Anlagenbau GmbHInventors: Hans BELL, Wilfried Kolb
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Publication number: 20080276801Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.Type: ApplicationFiled: February 20, 2006Publication date: November 13, 2008Applicant: Rehm Anlagenbau GmbHInventors: Hans Bell, Jurgen Felgner, Ralf Heidenreich
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Publication number: 20080061116Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.Type: ApplicationFiled: October 29, 2004Publication date: March 13, 2008Applicant: REHM ANLAGENBAU GmbHInventor: Hans Bell
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Publication number: 20050242163Abstract: Thermodynamic fluctuations caused conventionally during introduction of a relatively cold liquid into the vapor generator can be reduced considerably or eliminated by providing a preheating region, so that the necessary amount of vapor can be provided in a substantially continuous manner. Vapor generation can here be controlled on the basis of the vapor pressure in the evaporation region, wherein advantageously during operation of a soldering system the pressure in the corresponding process chamber can also be used for control in such a manner that there is always a pressure gradient and additional conveying means, such as pumps for the vapor supply, can thereby be avoided.Type: ApplicationFiled: April 20, 2005Publication date: November 3, 2005Applicant: Rehm Anlagenbau GmbHInventors: Hans Bell, Wilfried Kolb
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Patent number: 6649878Abstract: A heating device for heating merchandise, especially printed boards, comprises a feeding device provided in front of a least one heating line in the transport direction of the merchandise and a discharge device provided behind the heating line in the transport direction, wherein a number of heating zones/devices and/or cooling zones/devices or the like are associated with the heating line. To improve a heating device of the aforementioned type by increasing the throughput of merchandise in a simple manner, at least two heating lines are disposed on top of each other, to which merchandise can be separately fed by the feeding device from a horizontal transport level, and the merchandise can be separately discharged from the heating lines by the discharge device from the heating lines back into a horizontal transport level.Type: GrantFiled: December 7, 2000Date of Patent: November 18, 2003Assignee: Rehm Anlagenbau GmbHInventor: Johannes Rehm
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Patent number: 6619472Abstract: An adjusting unit for an article carrier is disclosed. The adjusting unit includes adjustable support elements for receiving articles of different sizes, in particular for supporting printed circuit boards of different sizes with a frame. One frame member of the frame may be used as a support for an article to be carried. At least one additional supporting element is provided which is adapted to be adjusted relative to a frame member. In addition, arresting structures are provided with the aid of which the supporting element can be arrested relative to the frame member. The arresting structures are adaptable to be releasably arrested on a guide, along which the supporting element is displaceable. Accordingly, the adjusting unit comprises adjustment structure for adapting the adjustable supporting element of the article carrier to the size of the printed circuit boards to be accommodated.Type: GrantFiled: February 6, 2001Date of Patent: September 16, 2003Assignee: Rehm Anlagenbau GmbHInventor: Johannes Rehm
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Patent number: 6484926Abstract: The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting the primary liquid into the vapor phase. The system is characterized in that primary liquid or the vapor thereof or both can be introduced by means of a primary-liquid fluid line into a soldering-zone heating module in fluid communication with the soldering zone and into a process-zone heating module in fluid communication with the process zone, the heating capacity of the soldering-zone heating module and of the process-zone heating module being adjustable independently of each other to thereby generate superheated vapor based on the zones. Furthermore, the invention relates to a method for operating a vapor phase reflow system.Type: GrantFiled: May 8, 2001Date of Patent: November 26, 2002Assignee: Rehm Anlagenbau GmbH + Co. KGInventor: Hans Bell
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Patent number: 6182819Abstract: An article carrier is disclosed having adjustable support elements for receiving articles of different sizes, in particular for supporting printed circuit boards of different sizes during transport through a reflow soldering system. The article carrier further comprises a frame, wherein especially one frame member of the frame is used as a support for an article to be carried, and at least one additional supporting element which is adapted to be adjusted relative to the frame member, wherein arresting elements are provided for arresting the support element relative to the frame member. One major aspect of the invention is the fact that the arresting elements are adapted to be releasably arrested on guide rods along which the supporting element is displaceable. Thus the article carrier may automatically be adapted to different sizes of printed circuit boards.Type: GrantFiled: March 1, 1999Date of Patent: February 6, 2001Assignee: Rehm Anlagenbau GmbH + Co.Inventor: Johannes Rehm
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Patent number: 6015966Abstract: In reflow soldering systems the circuit boards are conventionally transported in horizontal direction from a feed portion through a preheating portion, a main heat-treatment portion, a cooling portion and a discharge portion in linear fashion in the longitudinal direction of the system. Such reflow systems, however, are relatively long and therefore require a lot of space.Type: GrantFiled: March 2, 1998Date of Patent: January 18, 2000Assignee: Rehm Anlagenbau GmbH & Co.Inventor: Johannes Rehm