Patents Assigned to Rehm Anlagenbau GmbH & Co.
  • Circuit board heating apparatus
    Patent number: 6015966
    Abstract: In reflow soldering systems the circuit boards are conventionally transported in horizontal direction from a feed portion through a preheating portion, a main heat-treatment portion, a cooling portion and a discharge portion in linear fashion in the longitudinal direction of the system. Such reflow systems, however, are relatively long and therefore require a lot of space.
    Type: Grant
    Filed: March 2, 1998
    Date of Patent: January 18, 2000
    Assignee: Rehm Anlagenbau GmbH & Co.
    Inventor: Johannes Rehm