Abstract: The present invention relates to a vapor phase reflow system comprising at least one soldering zone and a process zone, a primary liquid reservoir containing a primary liquid, the vapor phase reflow system further comprising a heating means for converting the primary liquid into the vapor phase. The system is characterized in that primary liquid or the vapor thereof or both can be introduced by means of a primary-liquid fluid line into a soldering-zone heating module in fluid communication with the soldering zone and into a process-zone heating module in fluid communication with the process zone, the heating capacity of the soldering-zone heating module and of the process-zone heating module being adjustable independently of each other to thereby generate superheated vapor based on the zones. Furthermore, the invention relates to a method for operating a vapor phase reflow system.

Abstract: An article carrier is disclosed having adjustable support elements for receiving articles of different sizes, in particular for supporting printed circuit boards of different sizes during transport through a reflow soldering system. The article carrier further comprises a frame, wherein especially one frame member of the frame is used as a support for an article to be carried, and at least one additional supporting element which is adapted to be adjusted relative to the frame member, wherein arresting elements are provided for arresting the support element relative to the frame member. One major aspect of the invention is the fact that the arresting elements are adapted to be releasably arrested on guide rods along which the supporting element is displaceable. Thus the article carrier may automatically be adapted to different sizes of printed circuit boards.