Abstract: A process chamber for carrying out thermal processes in the manufacture of an electronic assembly with at least one opening for moving in and/or removing the electronic assembly; a supply of a protective gas; a controllable protection device arranged at the opening to reduce escape of the protective gas from the process chamber; and a control that can control the protection device such that, when the electronic assembly passes through the opening, an opening cross section of the opening is provided, which corresponds to the cross section of the electronic assembly.

Abstract: The present invention relates to devices and methods for measuring a varnish jet for a varnishing process for electronic subassemblies. Said devices and methods allow the width and symmetry of the varnish jet to be determined without performing any relative movement between the varnish jet and the sensor.

Abstract: A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

Abstract: The present invention relates to a device (100) for the heat treatment of substrates and to a method for recording measurement data in said device, where said device (100) comprises at least one heatable chamber (102), a carrier system (108), a sensor assembly (112), and an actuator (111) that is independent of the carrier system (108). The carrier system (108) is designed to carry substrates, whereas the sensor assembly (112) is further configured for coupling to a data recording and/or data storage device (130). The actuator (111) is coupled to the sensor assembly (112) and is configured to position the sensor assembly (112) within the heatable chamber (102).

Abstract: The present invention relates to a device (100) for the heat treatment of substrates and to a method for recording measurement data in said device, where said device (100) comprises at least one heatable chamber (102), a carrier system (108), a sensor assembly (112), and an actuator (111) that is independent of the carrier system (108). The carrier system (108) is designed to carry substrates, whereas the sensor assembly (112) is further configured for coupling to a data recording and/or data storage device (130). The actuator (111) is coupled to the sensor assembly (112) and is configured to position the sensor assembly (112) within the heatable chamber (102).

Abstract: Disclosed is a device for purifying a process gas in a reflow soldering system. Said device comprises a receptacle that contains at least one packing bed. The process gas is fed to the receptacle via a gas inlet while being discharged from the receptacle after penetrating the packing bed. The inventive device further comprises an apparatus for delivering a liquid fluid to the receptacle. Secondary materials of the soldering process in the reflow soldering system can be absorbed by the liquid fluid and thus be eliminated from the process gas. Secondary materials and/or droplets and vapors of the fluid can additionally be absorbed and adsorbed on the surface of the packing.

Abstract: The present invention is directed to a cleaning device for process gases of a reflow soldering system that includes a plurality of cleaning chambers. The plurality of cleaning chambers contain a cleaning liquid for the process gas, where each of the cleaning chambers is adapted to be flown through via a supply line for the contaminated process gas and via a discharge line for the cleaned gas. The cleaning chambers also include a plurality of cleaning walls along which the cleaning liquid is flown for take-up of impurities in the process gas into the cleaning liquid. A plurality of the deposition walls is provided, where at least one of the deposition walls also forms an outer wall of the cleaning device.

Abstract: According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a convection heater to control effective heat transmission occurring on said soldering item, it is also possible to adapt the soldering process in an extremely flexible manner to special process requirements by virtue of the fact that adjustment of a modified volume flow can be controlled in a very quick and precise manner.