Patents Assigned to Reiko Co., Ltd.
  • Patent number: 11014343
    Abstract: A transparent high-barrier film having flexibility and a high-barrier property is usable as a packaging material for pharmaceutical products, or as a flexible sealing material. The high-barrier film includes a plastic film and at least a barrier layer stacked thereon. The barrier layer is a layer in which two or more units are stacked, each unit having a structure in which a barrier layer A, a barrier layer B, and a barrier layer A are stacked in that order. The barrier layer A is a layer composed of SiOC in which the content ratio of carbon is in a range of more than 0% and less than 15%. The barrier layer B is a layer composed of SiOC in which the content ratio of carbon is in a range of 1.1 to 4.0 times the content ratio of carbon in the barrier layer A.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: May 25, 2021
    Assignee: REIKO CO., LTD.
    Inventors: Kimio Kawai, Ryo Nishiyama, Kazumi Yoshida
  • Patent number: 4928908
    Abstract: The balloon according to the invention is formed by heat-sealing at least one heat-sealable sheet which comprises a plastic film and a metal vapor deposition layer formed on one side of the plastic film. The metal vapor deposition layer is discontinuously formed so that the sheet has a metallic but insulating surface. Resultantly, the balloon having a dielectric breakdown voltage of not less than 1000 V can be easily obtained. Preferably, the metal vapor deposition layer is formed in a state of islands in the sea, the size of the island being 200 .ANG. to 1 .mu.m and the interval between the islands being 100 .ANG. to 5000 .ANG..
    Type: Grant
    Filed: November 16, 1989
    Date of Patent: May 29, 1990
    Assignee: Reiko Co., Ltd.
    Inventor: Shigeo Horii
  • Patent number: 4242378
    Abstract: The method of making a decorated film with a metal layer in the form of a given pattern comprises the steps of forming a metal layer on at least one surface of a base sheet through the utilization of the vacuum plating technique and removing a preselected area of said metal layer from said base sheet. When a water-insoluble resin is used, the resin is printed on the metal layer to form a positive resinous pattern and then the printed material is immersed in a metal soluble aqueous solution to remove the exposed metal layer without the resinous pattern. When a water-soluble resin is used, the resin is printed on the base sheet to form a negative resinous pattern and then the metal layer is formed on the surface with the resinous pattern. The resultant material is immersed in water to dissolve the resin and simultaneously remove the metal coated on the resinous pattern together with the resin.
    Type: Grant
    Filed: March 29, 1979
    Date of Patent: December 30, 1980
    Assignee: Reiko Co., Ltd.
    Inventor: Yoshiaki Arai