Abstract: The several clock lines on a burn-in board are monitored by diode ANDing the clock lines to one or two monitor lines, the ANDing circuitry being mounted on the burn-in board and each monitor line being connected through the burn-in chamber back wall to a detection circuit for detecting presence, level, and/or other quality of the signal on the monitor line and giving an indication and sounding an alarm when the desired monitor signal quality is absent.

Abstract: An improved connection assembly for connecting a burn-in component board located within a burn-in chamber to control circuitry located outside the chamber is disclosed. The assembly includes a connecting device for connecting the component board to the control circuitry. The improvement includes an isolation apparatus for isolating the connecting device from the chamber, the isolation apparatus including (i) a cavity extending through at least a portion of the wall of the chamber and defining a cavity base disposed between the inner surface of such wall and the exterior of such chamber and (ii) a cavity cover disposed between the cavity base and the interior of the chamber such that contact between the air of the chamber and the connecting device is substantially reduced and the flow of air between the inside and outside of the chamber adjacent the connector is substantially inhibited.

Abstract: This invention relates generally to burn-in apparatus and methods for stressing the physical and electrical limits of electronic components under controlled environmental and load conditions and more particularly to a system for temporarily packaging a plurality of semiconductors such that they can be connected to a common electrical input while under controlled environmental conditions including extremes of temperature. The invention has special utility in the handling of integrated circuit devices of the dual-in-line packaging type.