Abstract: A system and method for burning-in an integrated circuit comprises a socket capable of receiving and supporting the IC, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. A first thermal interface provides releasable thermal contact between the integrated circuit in the socket and a resiliently mounted heat absorbing member. A second thermal interface is provided between the heat absorbing member and the heat sink.

Abstract: A system and method for burning-in an integrated circuit chip including at least a socket capable of receiving and supporting the chip, electrical leads in the socket for connecting to corresponding leads on the chip, and a heat sink in thermal contact with a cooling medium. The heat sink includes a thermal interface in releasable thermal contact with the integrated circuit in the socket. The heat sink removes more heat from the integrated circuit than is generated during the burn-in process and the integrated circuit is maintained within a predetermined desired temperature range by monitoring the temperature of the integrated circuit and supplying make-up heat as needed. Multiple sockets can be grouped together and cooled by a manifolded cooling system, with the temperature of each integrated circuit being individually monitored and controlled.

Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: An improved transmission line network includes a transmission line connecting a signal source to a plurality of capacitive loads. Preferably, the transmission line is not terminated with its characteristic impedance. The transmission line may include capacitance added for the purpose of smoothing the rising or falling edge of signals distorted by reflections from the far end of the network. In addition, the transmission line network preferably includes resistance added in series with the transmission line for the purpose of dissipating reflections from the far end and thereby reducing distortion upstream from the series resistors. The capacitive loads may be connected to the transmission line through series resistors, the magnitudes of which are selected to obtain uniform rise or fall times at all loads.

Abstract: A distributed transmission line network for connecting a plurality of DUTs to a low-power driver includes a plurality of distributed transmission lines with distributed capacitors. The distributed capacitors are added to the distributed transmission lines to make the propagation delay on each line equal, thereby eliminating skewed input signals to the DUTs. The capacitors also minimize capacitive cross-talk between the plurality of distributed transmission lines. The distributed transmission line network includes a driver with an internal resistance that is much less than the characteristic impedance of the distributed transmission line to minimize the voltage drop at the driver. The distributed transmission line also includes an input RC network for speeding rise time and a termination RC network for minimizing reflections in the distributed transmission line.

Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: An improved burn-in board cartridge for use in burn-in and testing of IC packages in an automated burn-in and test system is disclosed. The cartridge includes printed circuit cards mounted on a single or both side faces of the cartridge, thereby permitting IC packages to be mounted on either or both sides of the cartridge. The cartridge includes a sturdy frame holding in place the printed circuit cards and providing strength to reduce damage to the circuit cards. Attached to the frame are rails which are used to position the cartridge in various apparatus such as burn-in chambers. Cooling tubes and electrical components can be placed inside the two-sided cartridge, between the printed circuit cards. The burn-in chamber is divided into zones with each zone having a number of slots into which a burn-in board is placed. The chamber includes rotating air diverters positioned at each end of a zone which are capable of channeling the heated air within the chamber around any one zone.

Abstract: An apparatus for inserting IC packages into sockets on a burn-in board and for extracting IC packages therefrom includes a plurality of loader/unloader mechanisms affixed to a rotatable platform, the platform being adapted to support one or more burn-in boards and to position sockets mounted on the burn-in boards beneath the loader/unloader mechanisms one row at a time. The loader/unloader mechanisms include a vacuum means for lifting IC packages and pneumatic cylinders for transporting the packages to and from the burn-in boards. IC packages are gravity fed along a delivery channel both to and from the loader/unloader mechanisms by rotation of the platform.

Abstract: A head assembly for a burn-in board loader and unloader comprises a mounting block having a generally vertical track. A main body is mounted on the mounting block and afforded vertical movement along the track. The main body has a vertical bore through which a vertically movable plunger extends. The main body also comprises at least three vertical mounting wire holes spaced-apart around the bore. A floating crown having a vertical bore through which the plunger extends is mounted on the upper end of the main body by mounting wires which are fixedly attached at their upper ends to the crown and extend downwardly into the mounting wire holes. The mounting wires are fixedly attached at their lower ends to the main body at the lower ends of the mounting wire holes. The crown is preferably mounted to provide a gap between the crown and main body of about 0.005 inch.

Abstract: There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.

Abstract: There is disclosed herein an apparatus for unloading IC packages from sockets on a burn-in board according to predetermined performance grades. The IC packages are displaced from the sockets by inserting tools through passageways extending through the burn-in board and socket to contact the underside of the IC package and push the IC package from its socket. Sorting is accomplished by collecting the displaced IC packages of a particular grade and storing them separate from all other IC packages.

Abstract: An apparatus for inserting integrated circuit packages into sockets on a burn-in board includes a plurality of loader heads, one for each column of sockets on the board, for pushing the packages into the sockets; a plurality of support means, one for each loader head, for aligning and supporting the package under the loader head; and a plurality of channels, one for each loader head, for delivering IC packages to the support means. Movement of the loader head in the downward direction clamps the IC package between the loader head and the support means for insertion of the package into the socket.