Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A thermal device includes a first thermal unit, a second thermal unit, and device electronics. The first thermal unit includes a first plurality of semiconductor elements sandwiched between first and second thermal unit substrates. The first thermal unit substrate exchanges heat with a user. The second thermal unit includes a second plurality of semiconductor elements sandwiched between third and fourth thermal unit substrates. The third thermal unit substrate exchanges heat with the user. The device electronics are coupled to the first thermal unit and the second thermal unit. The device electronics operate the first thermal unit in a heating state in which the first thermal unit transfers heat to the user via the first thermal unit substrate. The device electronics operate the second thermal unit in a cooling state in which the second thermal unit removes heat from the user via the third thermal unit substrate.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.

Abstract: A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.

Abstract: A thermal device includes a first thermal unit, a second thermal unit, and device electronics. The first thermal unit includes a first plurality of semiconductor elements sandwiched between first and second thermal unit substrates. The first thermal unit substrate exchanges heat with a user. The second thermal unit includes a second plurality of semiconductor elements sandwiched between third and fourth thermal unit substrates. The third thermal unit substrate exchanges heat with the user. The device electronics are coupled to the first thermal unit and the second thermal unit. The device electronics operate the first thermal unit in a heating state in which the first thermal unit transfers heat to the user via the first thermal unit substrate. The device electronics operate the second thermal unit in a cooling state in which the second thermal unit removes heat from the user via the third thermal unit substrate.

Abstract: A cooling device includes a package substrate, a plurality of cooling units, and device electronics. The plurality of cooling units are configured to cool a user's body. Each cooling unit includes a plurality of semiconductor cooling elements sandwiched between a first cooling unit substrate and a second cooling unit substrate. Each of the cooling units is connected to the package substrate. The device electronics are coupled to the cooling units. The device electronics are configured to store a first cooling device profile that includes data indicating an amount of power to deliver to each of the cooling units over a period of time. The device electronics are configured to deliver power to the cooling units according to the first cooling device profile, wirelessly receive a second cooling device profile from an external computing device, and deliver power to the cooling units according to the second cooling device profile.

Abstract: A heating device includes a heating unit and device electronics. The heating unit is configured to deliver heat to a user's body. The heating unit includes a substrate and a heating element supported by the substrate. The device electronics are coupled to the heating element and are configured to store a first heating profile that includes data indicating how power should be delivered to the heating element over a first period of time. The device electronics are configured to deliver power to the heating element according to the first heating profile. The device electronics are configured to wirelessly receive a second heating profile from an external computing device. The second heating profile includes data indicating how power should be delivered to the heating element over a second period of time. The device electronics are configured to deliver power to the heating element according to the second heating profile.