Abstract: In one embodiment, the present disclosure may be directed to a matching network coupled to an RF source and a plasma chamber and including an electronically variable capacitor (EVC) and a control circuit. The control circuit receives parameter signals and determines corresponding parameter values. For each parameter value, the control circuit determines whether the parameter value is relevant to the matching activity and whether the parameter value is relevant to a second activity of the matching network. The matching network carries out the matching activity based on the parameter values determined to be relevant to the matching activity, and carries out the second activity based on the parameter values determined to be relevant to the second activity.

Abstract: In one embodiment, the present disclosure is directed to an RF impedance matching network that includes an RF input coupled to an RF source, an RF output coupled to a plasma chamber, and an electronically variable capacitor (EVC). A first control circuit controls the EVC and is separate and distinct from a second control circuit controlling the RF source. To assist in causing an impedance match between the RF source and the plasma chamber, the first control circuit determines, using a match lookup table with a value based on a detected RF parameter, a new EVC configuration for providing a new EVC capacitance. To further cause the impedance match, the second control circuit alters the variable frequency of the RF source, but operates independently from the first control circuit.

Abstract: In one embodiment, the present disclosure is directed to a method for impedance matching. The RF source provides at least two repeating, non-zero pulse levels, including a high-priority pulse level and a low-priority pulse level. The matching network comprises at least one EVC, which comprises discrete capacitors configured to switch in and out to provide a plurality of match configurations. Each EVC has a switching limit comprising a predetermined number of switches in or out of the EVC's discrete capacitors in a prior time interval. Upon determining that switching to a new match configuration would cause an EVC to reach the switching limit, the method determines whether the new match configuration is for the low- or high-priority pulse level. If for the low-priority pulse level, the method prevents the switching of the EVC. If for the high-priority pulse level, the method switches the EVC to the new match configuration.

Abstract: In one embodiment, the present disclosure is directed to a method for impedance matching including a) positioning a matching network between a radio frequency (RF) source and a plasma chamber; b) determining, from among the plurality of match configurations, a new match configuration to be used when there is an expected pulse level change from a first of the pulse levels to a second of the pulse levels; and c) sending a control signal to alter the at least one EVC to provide the new match configuration. The control signal is sent a predetermined time period before a time for the expected pulse level change, the predetermined time period being substantially similar to a time period for the EVC to switch between two match configurations of the plurality of match configurations.

Abstract: In one embodiment, an RF impedance matching circuit is disclosed. The matching circuit is coupled between a plasma chamber and an RF source providing an RF signal having a frequency. The matching circuit includes a first electronically variable capacitor having a first variable capacitance and a second electronically variable capacitor having a second variable capacitance. A control circuit determines a first parameter related to the plasma chamber, and then determines, based on the first parameter, a first capacitance value for the first electronically variable capacitor and a second capacitance value for the second electronically variable capacitor. The control circuit then generates a control signal to alter the first variable capacitance and the second variable capacitance accordingly, causing the RF power reflected back to the RF source to decrease while the frequency of the RF source is not altered.

Abstract: In one embodiment, the invention can be an impedance matching network including an input configured to operably couple to a radio frequency (RF) source; an output configured to operably couple to a load; a first variable capacitor; a second variable capacitor; and a third capacitor in series with the second variable capacitor and reducing a voltage on the second variable capacitor.

Abstract: In one embodiment, an RF impedance matching network for a plasma chamber is disclosed. It includes a variable capacitor comprising a plurality of capacitors comprising first coarse capacitors each having a substantially similar first coarse capacitance, second coarse capacitors each having a substantially similar second coarse capacitance, and fine capacitors having different capacitances that increase in value. At least one of the fine capacitors has a capacitance greater than the first coarse capacitance. A control circuit is configured cause a gradual increase in the total capacitance of the variable capacitor by switching in, in a predetermined order, each of the first coarse capacitors, followed by each of the second coarse capacitors, only switching in the fine capacitors whose capacitance is less than a capacitance of a next coarse capacitor of the coarse capacitors predetermined to be switched in next.

Abstract: In one embodiment, the invention can be a variable capacitor that includes a plurality of capacitors operably coupled in parallel, and a plurality of switches coupled in series with corresponding capacitors. The plurality of capacitors can include first capacitors increasing in capacitance, and second capacitors having a substantially similar capacitance. Further, for each first capacitor increasing in capacitance, the change to the total capacitance that is provided by the first capacitor when its corresponding switch is closed can increase by a factor of about two.

Abstract: In one embodiment, an impedance matching network includes at least one electronically variable capacitor (EVC), each EVC comprising discrete capacitors having corresponding switches, the switches configured to switch in and out the discrete capacitors to alter a total capacitance of the EVC. Each switch includes a first terminal operably coupled to the corresponding discrete capacitor, a second terminal, and a switching circuit coupled between the first terminal and the second terminal, the switching circuit comprising a switching transistor. A tuning inductor is coupled parallel to the switching circuit. A value for the tuning inductor enables the tuning inductor to cancel a cumulative parasitic capacitance of the switching circuit.

Abstract: In one embodiment, the present disclosure is directed to a method for matching an impedance. The method can include determining or receiving a reflection parameter value at an RF input or output; stopping the altering of a first capacitance and a second capacitance when the reflection parameter value is at or below a first reflection value; causing a limited altering of the first capacitance and the second capacitance to pursue an impedance match when the reflection parameter value is at or above a second reflection value and at or below the third reflection value; and causing an unlimited altering of the first capacitance and the second capacitance to pursue an impedance match when the reflection parameter value is at or above a third reflection value.

Abstract: In one embodiment, a semiconductor processing tool includes a plasma chamber and an impedance matching circuit. The matching circuit includes a first electronically variable capacitor having a first variable capacitance, a second electronically variable capacitor having a second variable capacitance, and a control circuit. The control circuit is configured to determine a variable impedance of the plasma chamber, determine a first capacitance value for the first electronically variable capacitor and a second capacitance value for the second electronically variable capacitor, and generate a control signal to alter at least one of the first variable capacitance and the second variable capacitance to the first capacitance value and the second capacitance value, respectively. An elapsed time between determining the variable impedance of the plasma chamber to when RF power reflected back to the RF source decreases is less than about 150 ?sec.

Abstract: A control circuit for a impedance matching circuit having first and second capacitor arrays receives as input one or more RF parameters of the impedance matching circuit, and in response thereto: determines a first match configuration for the first capacitor array and a second match configuration for the second capacitor array to create an impedance match between a fixed RF source impedance and a variable RF load impedance, the first match configuration and the second match configuration being determined from one or more look-up tables and based upon the detected one or more RF parameters; and alters at least one of the first array configuration and the second array configuration to the first match configuration and the second match configuration, respectively, by controlling the on and off states of (a) each discrete capacitor of the first capacitor array and (b) each discrete capacitor of the second capacitor array.

Abstract: In one embodiment, the invention can be a system for cooling an enclosure enclosing electrical components and configured to prevent air and exhaust from escaping the enclosure. The system can include a heat sink comprising a heat exchanger, and a tube extending into and out of the heat exchanger, the tube configured to transport liquid through the heat exchanger. The system can further include a fan configured to push air heated by electrical components onto the heat exchanger. The heat exchanger can be configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the heat exchanger.

Abstract: Apparatuses for controlling gas flow are important components for delivering process gases for semiconductor fabrication. In one embodiment, an apparatus for controlling gas flow is disclosed, the apparatus delivering two gas flows at a known ratio. Specifically, the apparatus has first and second on/off valves and first and second flow restrictors. The first and second on/off valves may be altered between an open state and a closed state. When both the first and second on/off valves are in an open state, first and second gas flows are delivered to first and second outlets. The first and second gas flows are provided at a known ratio to one another, this ratio determined by the ratio of the resistance to flow of the first and second flow restrictors.

Abstract: Methods, systems, and devices for combining an over-the-air broadcast signal with another digital media signal are described. Broadcast signals may be received at a user's location, demodulated, and then remodulated using the modulation scheme of a non-broadcast signal. The remodulated broadcast signal may then be combined with the non-broadcast signal, and the combined signal may be transmitted to a user's video equipment. In some cases, a channel guide interface may be provided that includes both the broadcast and non-broadcast media channels.

Abstract: A system and method mitigate the effects of these external vibrations on a capacitance diaphragm gauge by sensing the motion of the diaphragm at the first natural frequency of the diaphragm of the CDG. The presence of the natural frequency signals superimposed on the pressure signal is determined by sensing variations in the output of a sensor at or near the known natural frequency of the diaphragm and filtering that known low frequency from the output. The filtered signal is used in a feedback circuit to impose electrostatic forces on the diaphragm. The imposed electrostatic forces oppose the motion created by the external vibration to suppress the effects of the vibration on the pressure measured by the CDG.

Abstract: A system and a method detect contamination of a diaphragm in a capacitance diaphragm gauge wherein a contaminated diaphragm deflects less in the presence of pressure than an uncontaminated diaphragm. The system and method measure a base pressure. A DC voltage is applied between the diaphragm and a fixed electrode to cause the diaphragm to deflect to simulate an effective pressure. The system and method measure a combined pressure caused by the base pressure and the effective pressure. The system and method subtract the base pressure to determine the effective pressure caused by the static diaphragm deflection. If the measured effective pressure is less than an acceptable effective pressure, the system and method determine that the diaphragm is contaminated.

Abstract: A system and method detect the presence of an unacceptable quantity of gas molecules in the reference vacuum cavity of a capacitance diaphragm gauge (CDG). An independent pressure transducer has an active portion exposed to the reference vacuum cavity. The transducer includes a ring anode, a cylindrical inner wall surface that forms at least one cathode, and a magnet positioned with respect to the ring anode such that the magnetic flux of the magnet is generally aligned with the central axis of the ring anode. A high voltage source applies a voltage between the ring anode and the cathode. A current sensor senses a magnitude of any current flowing between the ring anode and the cathode via ionized gas molecules. A monitoring unit monitors the magnitude of the current sensed by the current sensor and activates an alarm when the magnitude of the current exceeds an acceptable magnitude.

Abstract: In order to mitigate the negative effects of a change in atmospheric pressure, an improved capacitance diaphragm gauge (CDG) sensor incorporates an independent ambient atmospheric pressure sensor near the CDG sensor body. The ambient atmospheric sensor is located outside the CDG sensor body to sense the ambient atmospheric pressure surrounding the CDG sensor body. The ambient atmospheric sensor provides an output that represents the ambient atmospheric pressure. A sensor output processing circuit receives the output of the ambient atmospheric sensor as well as the output of the CDG sensor. The processing circuit utilizes the output from the ambient atmospheric pressure sensor to fine tune the CDG measurement of pressure by executing an in situ, real time, automatic calibration adjustment of the CDG.

Abstract: Smokehouses (20) or other similar thermal processing cabinets or houses are provided with improved floor assemblies (22) which eliminate fluid collection and provide a high degree of structural integrity. The smokehouses (20) include upright walls (24, 26) supported on the floor assemblies (22). Each floor assembly (22) has one or more weldment frame assemblies (38) including a peripheral frame assembly (46) with opposed wall receiving channel segments (52) and frame elements (54). Drainage structure such as one or more tubular drain units (44) are also preferably secured to the weldment frame assemblies (38) and are positioned to effect proper liquid drainage. Tread plates (42) are secured to the weldment frame assemblies (38). In order to construct a floor assembly (22), an appropriately sized recess (66) is formed and the weldment frame assemblies (38) and drain units (44) are installed. A monolithic pour of concrete (40) is then placed within the weldment frame assemblies (38) and allowed to cure.