Abstract: Circuit modules comprise a carrier surface with components mounted thereon. A testing apparatus for these modules comprises a magazine for hosting a row of circuit modules. The row is pushed into a gripper of a pickup mechanism by means of a press-on member. As a consequence, the orientation of the magazine can be horizontal. The gripper removes the gripped modules in a direction in line with the row. The press-on member preferably comprises a rotatable press-on plate which rotates along with the row of modules if it starts to fan out, but at the same time pushes the row back so that significant fanning is prevented.