Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.
Type:
Application
Filed:
May 27, 2010
Publication date:
January 6, 2011
Applicant:
Replisaurus Technologies AB
Inventors:
Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
Abstract: The present invention concerns an electrochemical pattern replication method, ECPR, and a construction of a conductive electrode for production of applications involving micro and nano structures. An etching or plating pattern, which is defined by a conductive electrode, a master electrode, is replicated on an electrically conductive material, a substrate. The master electrode is put in close contact with the substrate and the etching/plating pattern is directly transferred onto the substrate by using a contact etching/plating process. The contact etching/plating process is performed in local etching/plating cells, that are formed in closed or open cavities between the master electrode and the substrate.
Type:
Grant
Filed:
December 15, 2003
Date of Patent:
September 7, 2010
Assignee:
Replisaurus Technologies AB
Inventors:
Patrik Möller, Mikael Fredenberg, Peter Wiwen-Nilsson
Abstract: An electrode for forming an electrochemical cell with a substrate and a method of forming said electrode. The electrode comprises a carrier (1) provided with an insulating layer (7) which is patterned at a front side. Conducting material in an electrode layer (4) is applied in the cavities of the patterned insulating layer and in contact with the carrier. An connection layer (5) is applied at the backside of the carrier and in contact with the carrier. The periphery of the electrode is covered by the insulating material.
Type:
Application
Filed:
November 20, 2006
Publication date:
September 17, 2009
Applicant:
REPLISAURUS TECHNOLOGIES AB
Inventors:
Mikael Fredenberg, Patrik Moller, Peter Wiwen-Nilsson, Cecilia Aronsson, Matteo Dainese