Abstract: An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young modulus tensile value at 25° C. of 500 MPa to 5 GPa, and includes at least one migrating agent suitable for migrating up to at least two interfaces of the joint (14) in order to generate interfacial detachment. A composition suitable for bonding the assembly, a method for assembling the assembly by bonding and a method for dismantling the bonded assembly via migration and creation of an interfacial detachment by heating the body thereof are also described.

Abstract: An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young's tensile modulus value at 25° C. of between 0.1 and 500 MPa, and includes at least one migrating agent suitable for migrating up to at least one of the interfaces of the joint (14) in order to generate interfacial detachment. A composition enabling the bonding of the assembly, a method for mounting the assembly by bonding, and a method for dismantling the bonded assembly by way of migration and creation of an interfacial detachment by localized heating are also described.

Abstract: A composition designed for the detachable assembly of a first substrate and a second substrate by gluing, includes an adhesive polymer base and at least one active substance. The active substance is encapsulated in a wax matrix so as to prevent any reaction with the adhesive polymer material during the storage of the composition or during its implementation. A process for preparing this composition is also described.