Abstract: An image sensor includes a pixel array configured to receive a driving signal, sense a light signal reflected from an object in response to the driving signal, and generate pixel clock signals indicating delay of the driving signal; a reference clock circuit configured to generate a reference clock signal; and a time-to-analog convert circuit configured to convert delay times between the pixel clock signals and the reference clock signal into analog values.
Type:
Grant
Filed:
May 4, 2020
Date of Patent:
May 18, 2021
Assignees:
SK hynix Inc., RESERCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
Abstract: A semiconductor device includes a plurality of semiconductor chips vertically stacked and electrically coupled to one another through TSVs (Through-Silicon Vias), a plurality of semiconductor elements formed in each of the semiconductor chips, a plurality of nodes suitable for coupling the semiconductor elements to one another, and a node control device suitable for being provided in each of the nodes, deciding whether to couple the node to a communication path based on a temperature of the node, and setting a shortest communication path among the semiconductor elements.
Type:
Grant
Filed:
March 24, 2015
Date of Patent:
July 17, 2018
Assignees:
SK Hynix Inc., Reserch & Business Foundation Sungkyunkwan University