Patents Assigned to Resikast Corporation
  • Patent number: 5445890
    Abstract: This invention relates to multiple glass/plastic laminates for ballistic resistant and security applications. The laminates typically comprise a glass lite and a plastic sheet, such as polycarbonate, bonded with an adhesive based on a novel solvent free thermosetting alkyd resin. Subsequent layers can be polycarbonate sheets and/or acrylic sheets and glass lites with the adhesive layer separating the lites and sheets.Further, this invention relates to a vertical liquid pour process which enables the rapid manufacture of bullet resistant glass/plastic laminates without the need for expensive ultra-violet or heat curing ovens. The adhesive cures at temperatures ranging from 60.degree. F. to 90.degree. F. High temperature and high pressure treatments are unnecessary. Laminates produced in this manner with adhesive interlayer will pass all intended ballistic or security tests within a 12 hour period.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: August 29, 1995
    Assignee: Resikast Corporation
    Inventors: Charles E. Bayha, H. Arne Sudlow
  • Patent number: 5318853
    Abstract: This invention relates to multiple glass/plastic laminates for ballistic resistant and security applications. The laminates typically comprise a glass lite and a plastic sheet, such as polycarbonate, bonded with an adhesive based on a novel solvent free thermosetting alkyd resin. Subsequent layers can be polycarbonate sheets and/or acrylic sheets and glass lites with the adhesive layer separating the lites and sheets.The resin developed specifically for this application is an unsaturated polyester designed to be highly flexible, tough, low exotherm and compatible with t-butyl styrene. This monomer is unique in that it does not etch acrylic or polycarbonate sheets.Further, this invention relates to a vertical liquid pour process which enables the rapid manufacture of bullet resistant glass/plastic laminates without the need for expensive ultra-violet or heat curing ovens. The adhesive cures at temperatures ranging from 60.degree. F. to 90.degree. F.
    Type: Grant
    Filed: July 22, 1992
    Date of Patent: June 7, 1994
    Assignee: Resikast Corporation
    Inventors: Charles E. Bayha, H. Arne Sudlow