Patents Assigned to Resolution Performance Products
  • Composition of epoxy resin and triazine-formaldehyde-phenol resin
    Patent number: 6515047
    Abstract: An epoxy resin composition used for semiconductor encapsulating, laminated boards or electrical insulation is prepared from a thermosetting resin composition containing: (A) an epoxy resin and (B) a phenol resin represented by the following general formula (1): wherein R1 and R2 are a hydrogen atom or alkyl group having 1 to 4 carbon atoms, and R3 is an amino group, alkyl group having 1 to 4 carbon atoms, phenyl group, vinyl group or the like, and wherein m is an integer of 1 or 2.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: February 4, 2003
    Assignee: Resolution Performance Products
    Inventors: Takao Fukuzawa, Takayoshi Hirai, Tetsuro Imura, Yoshinobu Ohnuma