Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.

Abstract: A amidoamine composition containing oligomeric amidoamine compounds having the structure: the average of x based on the amidoamine composition is at least 0.2, and Z is the residue of a polyoxyalkylene polyether polycarboxylic acid compound, and the amidoamine composition is the reaction product of primary polyamine compounds with polyoxyalkylene polyether polycarboxylic acid compounds at a corresponding equivalent weight ratio of at least 4.0:1 under oligomeric reaction conditions effective to increase the amine nitrogen equivalent weight of the amidoamine composition by at least 10% over the average acid equivalent weight of said polyoxyalkylene polyether polyacid composition. There is also provided glycidated amidoamine compositions used as epoxy functional surfactants, and the aqueous epoxy resin dispersions thereof, and the curable epoxy resin compositions thereof.

Abstract: An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.

Abstract: A process for the manufacture of glycidylester compositions by (a) reacting: (i) at least one cyclohexyl anhydride compound A; (ii) at least one di-secondary or di-primary hydroxyl compound B containing two (cyclo)aliphatic hydroxyl groups; (iii), at least one di-secondary carboxylic acid or anhydride compound C; and (iv) a mono-glycidyl ester of an ?,?-branched carboxylic acid compound D containing from 5 to 19 carbon atoms; and (b) reacting the carboxyl functional polyester from step (a) with an excess epihalohydrin in the presence of a base.

Abstract: A curing agent for epoxy resins, comprising (a) 30 to 99 parts by weight of (i) a modified phenol resin, which is obtained by polycondensation of a heavy oil or pitch, a phenol and an aldehyde compound in the present of an acid catalyst, and/or of (ii) a a phenol resin having a hydrocarbon group with small polarity between phenol nuclei represented by the following general formula (I): wherein R1's may be the same or different from each other and each represent an alkyl group having 1 to 10 carbon atoms, substituted or nonsubstituted phenyl group, substituted or nonsubstituted aralkyl group or alkoxy group; Z's may be the same or different from each other and each represent a divalent hydrocarbon group having 1 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded, at least one Z in one molecule is a divalent hydrocarbon group having 5 to 20 carbon atoms to which a nitrogen atom, oxygen atom, phosphorus atom or sulfur atom may be bonded; n is a number of 0 to 8

Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.

Abstract: A composition comprises a curing agent or coreactant and a glycidyl ester produced by reacting a carboxyl-functional polyester having an acid value of less than 280 mg KOH/gram with excess epihaloydrin in the presence of a base and, optionally, a catalyst, wherein the carboxyl-functional polyester is produced by reacting (a) at least on cyclohexyl anhydride A; (b) at least one di-secondary or di-primary hydroxyl compound B containing two (cyclo)aliphatic hydroxyl groups; (c) at least one di-secondary carboxylic acid or anhydride C; and (d) a monoglycidyl ester of an alpha,alpha-branched carboxylic acid D containing from 5 to 19 carbon atoms.

Abstract: There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.

Abstract: A amidoamine composition containing oligomeric amidoamine compounds having the structure: the average of x based on the amidoamine composition is at least 0.2, and Z is the residue of a polyoxyalkylene polyether polycarboxylic acid compound, and the amidoamine composition is the reaction product of primary polyamine compounds with polyoxyalkylene polyether polycarboxylic acid compounds at a corresponding equivalent weight ratio of at least 4.0:1 under oligomeric reaction conditions effective to increase the amine nitrogen equivalent weight of the amidoamine composition by at least 10% over the average acid equivalent weight of said polyoxyalkylene polyether polyacid composition. There is also provided glycidated amidoamine compositions used as epoxy functional surfactants, and the aqueous epoxy resin dispersions thereof, and the curable epoxy resin compositions thereof.

Abstract: The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or more carboxylic acid precursor(s). The present invention further provides phenol-dicarbonyl condensates, epoxy resins, epoxy resin systems and laminates prepared using these phenol-dicarbonyl condensates.

Abstract: The present invention relates to a process for the production of aliphatic ketimines having a polyalkylenepolyamine content of less than 1% by weight from the corresponding aliphatic ketones and polyalkylenepolyamines comprising the steps of: (a) forming a mixture of said aliphatic ketones and said polyalkylenepolyamines wherein the weight ratio of said ketone to said polyalkylenepolyamine is in the range of about 3.0:1 to about 10:1; (b) heating said mixture to a refluxing temperature between about 170° F. and 230° F. while continuously removing water to form the corresponding aliphatic ketimine; and (c) isolating said aliphatic ketimine.

Abstract: Process for the manufacture of diglycidylesters of &agr;,&agr;′-branched dicarboxylic acids, comprising (a) the reaction of the &agr;,&agr;′-branched dicarboxylic acid with a halo substituted monoepoxide such as an epihalohydrin, in a 1.1-20 acid equivalent ratio relative to the &agr;,&agr;′-branched aliphatic dicarboxylic acid, optionally in the presence of water and water-miscible solvent, and in the presence of a catalyst in an amount of at most 45 mol % of the acid equivalent amount of the &agr;,&agr;′-branched aliphatic dicarboxylic acid, at a temperature in the range of from 30 to 110° C., during a period in the range of from 0.5 to 2.5 hr, (b) addition of alkali metal hydroxide or alkali metal alkanolate up to an acid equivalent ratio as to the &agr;,&agr;′-branched aliphatic dicarboxylic acid in the range of from 0.9:1 to 1.2:1, and reaction at a temperature of from 0 to 80° C.

Abstract: Modified epoxy functional polyesters are provided by reacting epihalohydrin in the presence of a base with carboxyl functional polyester resins (II) obtainable by reacting: (a) at least one aromatic or cycloaliphatic dicarboxylic acid compound A comprising two aromatic- or secondary aliphatic carboxyl groups or the anhydride thereof; (b) at least one diol compound B comprising two aliphatic hydroxyl groups, which may independently be a primary or a secondary hydroxyl group; and optionally (c) compound C1 comprising one monofunctional primary- or secondary hydroxyl group and/or at least one compound C2 comprising one primary- or secondary hydroxyl group and one tertiary aliphatic carboxyl group; and optionally (d) a dihydroxymonocarboxylic acid compound D comprising a tertiary aliphatic carboxyl group and two aliphatic hydroxyl groups, which may each independently be primary or secondary hydroxyl; and optionally (e) a trihydroxyalkane (E1) or tetrahydroxyalkane (E2), the molar ratio of compounds A:B:C1:C

Abstract: Curable flame-resistant substantially halogen free epoxy resin compositions, comprising: (a) one or more bifunctional or polyfunctional epoxy resin; (b) a specific phosphorous-containing compound; (c) a curing agent consisting of oligomers of styrene and maleic acid and/or maleic anhydride and/or salts or esters of maleic acid; (d) a curing catalyst; and optionally; (e) additives; prepregs derived from said compositions and laminates derived from said prepregs.

Abstract: A curable epoxy composition comprises an epoxy resin having at least 1.5 epoxy groups per molecule and an amine-terminated polyamide. The liquid amine-terminated polyamide is prepared by reacting a long-chain, C20-C60 dicarboxylic acid or derivative with an amine having a general formula of R1—NH—R2—NH—R3.

Abstract: The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing continuously (i) a liquid epoxy resin having a first molecular weight, (ii) a catalyst and (iii) a compound having at least one active hydrogen or reactive functional group capable of reacting with the liquid epoxy resin in the presence of the catalyst, flow through one or more reaction chambers and under conditions effective to produce a stream comprising an upstaged epoxy resin product having a second molecular weight. The second molecular weight is higher than the first molecular weight.

Abstract: A process for the manufacture of a polyphenol compound such as bisphenol-A by introducing into a reaction zone a phenolic compound reactant, a carbonyl compound reactant, and a catalyst promoter comprising a dithioketal compound, and reacting the ingredients within the reaction zone in the presence of an acid catalyst.

Abstract: A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

Abstract: A glycidyl ester is produced by reacting a carboxyl-functional polyester having an acid value of less than 280 mg KOH/gram with excess epihalohydrin in the presence of a base and, optionally, a catalyst, wherein the carboxyl-functional polyester is produced by reacting (a) at least one cyclohexyl anhydride A; (b) at least one compound B containing two (cyclo)aliphatic hydroxyl groups which is a di-secondary or di-primary hydroxyl compound, and if C is present, monoepoxide D which is a monoglycidyl ester of an &agr;,&agr;-branched, C5-C19 carboxylic acid; and, optionally, (c) at least one di-secondary carboxylic acid or anhydride C.

Abstract: The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1; (c) one or more optional polyamine(s); (d) one or more optional filler(s); and (e) one or more optional modifying resin(s) wherein the tensile modulus of the thermoset epoxy waterproofing membranes is less than 200,000 psi and the tensile elongation of the thermoset epoxy waterproofing membranes is greater than 20%.