Patents Assigned to Resonetics, LLC
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Patent number: 9694446Abstract: Methods and systems for drilling precise orifices in a wall of non-uniform thickness are provided. In one aspect, a thickness profile of at least a portion of the wall is created and the wall is irradiated with at least one laser beam to ablate a portion of the wall to thereby form an orifice in the wall. During the irradiation, one or more parameters of the least one laser beam are adjusted one or more times in accordance with the thickness profile to compensate for the non-uniform thickness of the wall.Type: GrantFiled: December 1, 2014Date of Patent: July 4, 2017Assignee: RESONETICS, LLCInventors: Rong Gu, David L. Wall, Sergey V. Broude
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Patent number: 9511448Abstract: A laser machining system for machining a work-piece includes a laser scanning head, external optical subsystems, and an image acquisition device. The external optical subsystems correspond to optical channels that include a first optical channel and a second optical channel. The laser scanning head controls an optical path so that a laser beam is directed and focused on the work-piece through the first optical channel and the second optical channel at different times. The first optical channel and the second optical channel correspond to respective specific portions of the work-piece to be machined by the laser beam. The image acquisition device is positioned to view the work-piece through the optical path. The image acquisition device acquires via the first optical channel one or more images of the work-piece to determine a displacement of the work-piece with reference to a best optical focus position of the second optical channel.Type: GrantFiled: August 10, 2015Date of Patent: December 6, 2016Assignee: RESONETICS, LLCInventors: Pascal Miller, Sergey V. Broude, David L. Wall, Kenneth Todd McDaniel, David S. Holbrook
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Publication number: 20150273188Abstract: In some embodiments of the present disclosure, a method for manufacturing a polymeric medical balloon is provided which may include providing a mold, wherein the mold comprises a plurality of assembled parts configured for separation to remove a molded balloon, configuring the interior surface of a least a portion of at least one part of the mold with one or more micro-features, inserting a balloon preform within the mold, and expanding the preform within the mold to obtain an expanded balloon. The one or more micro-features of the mold produce one or more corresponding features on the surface of the expanded balloon, and the one or more corresponding features on the surface of the expanded balloon effect at least one of a depth and height between about 10 ?m and about 500 ?m such that the one or more corresponding features are configured as reference points for positional registration of the balloon for subsequent processing of the expanded balloon.Type: ApplicationFiled: March 26, 2014Publication date: October 1, 2015Applicant: RESONETICS, LLCInventors: Rong Gu, Timothy P. Malone, David Torres
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Patent number: 9132585Abstract: Embodiments of the present disclosure are directed to systems (300), devices and methods for machining a work-piece from a plurality of directions using a single laser beam and galvanometer scan head (302). In some embodiments, such a system includes, for example, a scanning galvanometer head (“scan-head”) (302), having one or more mirrors (323) for directing a laser beam in at least one plane. Preferably, in some embodiments, the scan-head includes two mirrors for deflecting the laser beam in the at least one plane (e.g., an X-Y plane). A plurality of second mirrors (312A, 312B, 312C) is arranged after the scan-head (302) to direct the laser onto a predetermined portion of the exterior of the object to be machined. In some preferred embodiments, there are three such second mirrors (312A, 312B, 312C) each to direct the laser over a 120 degree area of the object.Type: GrantFiled: December 30, 2010Date of Patent: September 15, 2015Assignee: RESONETICS, LLCInventors: Pascal Miller, Sergey Broude, David L. Wall, Kenneth Todd McDaniel
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Patent number: 8772671Abstract: Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.Type: GrantFiled: May 20, 2011Date of Patent: July 8, 2014Assignee: Resonetics, LLCInventors: Sergey V. Broude, Chen-Hsiung Cheng, Pascal Miller, Glenn Ogura, David L. Wall
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Publication number: 20130193618Abstract: Embodiments of the present disclosure are directed to systems (300), devices and methods for machining a work-piece from a plurality of directions using a single laser beam and galvanometer scan head (302). In some embodiments, such a system includes, for example, a scanning galvanometer head (“scan-head”) (302), having one or more mirrors (323) for directing a laser beam in at least one plane. Preferably, in some embodiments, the scan-head includes two mirrors for deflecting the laser beam in the at least one plane (e.g., an X-Y plane). A plurality of second mirrors (312A, 312B, 312C) is arranged after the scan-head (302) to direct the laser onto a predetermined portion of the exterior of the object to be machined. In some preferred embodiments, there are three such second mirrors (312A, 312B, 312C) each to direct the laser over a 120 degree area of the object.Type: ApplicationFiled: December 30, 2010Publication date: August 1, 2013Applicant: RESONETICS LLCInventors: Pascal Miller, Sergey Broude, David L. Wall, Kenneth Todd McDaniel
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Patent number: 8278590Abstract: Embodiments of the present invention are directed to methods and systems for laser micro-machining, which may include dividing a long line illumination field into a plurality of individual fields, wherein each of the plurality of fields includes an aspect ratio of about 4:1 or greater, directing the plurality of individual fields onto at least one mask, wherein each individual field illuminates a corresponding area on the mask and translating the mask and/or workpiece relative to one another along a scan axis.Type: GrantFiled: May 27, 2005Date of Patent: October 2, 2012Assignee: Resonetics, LLCInventors: Brian Hall, David S. Holbrook, David L. Wall
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Publication number: 20120000893Abstract: Methods and systems for precisely removing selected layers of materials from a multi-layer work piece using laser ablation are disclosed. Precise removal of one or more selected layers of materials of a work piece may be performed by irradiating at least one location on a multi-layer work piece with a laser beam, ablating material at the at least one location, detecting one or more characteristics of the material ablated at the at least one location and analyzing the one or more characteristics to identify a change in at least one of the one or more characteristics that indicates a change in the type of material being ablated. Related systems are also described.Type: ApplicationFiled: May 20, 2011Publication date: January 5, 2012Applicant: Resonetics, LLCInventors: Sergey V. Broude, Chen-Hsiung Cheng, Pascal Miller, Glenn Ogura, David L. Wall