Patents Assigned to Reveo, Inc.
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Patent number: 7420147Abstract: A method of fabricating a multichannel plate is provided. The method includes providing a N layers, each layer having an array of wells formed therein. The N layers are aligned and stacked. The stack of N layers are sliced along a first and second line of the array of wells. The first line of the array of wells provides a first surface corresponding to a first array of channel openings of the MCP, and the second line of said array of wells provides a second surface corresponding to a second array of channel openings of the MCP. This method provides several functional benefits compared to conventional methods. These include, but are not limited to: the ability to produce well known and well characterized channels; the ability to produce well known and well characterized periods between channels; the ability to produce channels having any desired secondary electron emission enabling material therein; the ability to fabricate the substrate and/or final MCP of silicon.Type: GrantFiled: April 24, 2006Date of Patent: September 2, 2008Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7413638Abstract: A lithography device includes one or more conductive strips monolithically embedded within an insulative structure. A method of manufacturing a lithography device includes monolithically forming a conductive strip through an insulative structure. Monolithically forming such a device includes forming the conductive strip on an mixed conductive-insulative layer, and embedding the conductive-insulative layer layer within the insulative structure. Such a device may readily be manufactured, is reliable, and is capable of various lithography applications and other applications requiring sub-micron and nano-scale electrode devices and electrode arrays.Type: GrantFiled: March 10, 2005Date of Patent: August 19, 2008Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7388767Abstract: Electronic memory devices fabricated using nanolithography techniques enables rapid and reliable storage of data on a substrate. One such device includes a memory access head, which includes a conductive member and an insulative member. The conductive member includes a proximal conductive tip, a distal conductive tip, and a body portion. The body portion is embedded in the insulative member. The device further includes a substrate adjacent to the distal conductive tip, an electrolyte disposed between the distal conductive tip and the substrate; and a microchip in communication with the proximal conductive tip.Type: GrantFiled: July 13, 2005Date of Patent: June 17, 2008Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7377948Abstract: Methods of the present invention are provided for forming a plurality of electrochemical cell layers, each cell layer generally including a pair of electrodes and a separator electrically insulating the pair of electrodes. Cells of a desired size are formed by slicing the laminar sheet through both opposing major surfaces. In certain embodiments, individual cells are defined by fill regions, filled with removable substances. Thus, when the cells are sliced, individual cells and in certain embodiments current collectors or conductors are exposed with minimal or no further processing. In other embodiments, fluid access channels or porous layers are filled with removable substances. Thus, when the cells are sliced, structural support is provided for the intended void regions.Type: GrantFiled: June 5, 2003Date of Patent: May 27, 2008Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7365894Abstract: Electrode structures including transparent electrode structures, in particular self supporting electrode structures, are described herein. Further, applications of the herein novel electrode structures are provided, including electronic writing tablets, electronic paper and fabrication methods for electronic writing tablets and electronic paper. The electrode structure may be transparent and self-supporting, thereby providing a novel electrode structure as compared to conventional transparent electrodes.Type: GrantFiled: October 4, 2004Date of Patent: April 29, 2008Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7349059Abstract: Herein provided is a liquid crystal cell manufacturing process and assembly system. Mechanical steps are performed under substantially atmospheric conditions (as opposed to in a vacuum environment) thereby simplifying liquid crystal cell assembly. Under such conditions, it is economically feasible to produce large panel, bubble-free liquid crystal cells.Type: GrantFiled: October 4, 2004Date of Patent: March 25, 2008Assignee: Reveo, Inc.Inventors: Yingqiu Jiang, Marvin Ancheta, Swee Yong Pung, Wan Kwau Cheou
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Patent number: 7233426Abstract: An optical transistor is disclosed. The optical transistor consists of a high speed photodetector region incident to a light intensity modulating region which separates a drain and source region. The disclosed optical transistor is able to exhibit high speed performance with good signal isolation and high amplification gain.Type: GrantFiled: September 9, 2005Date of Patent: June 19, 2007Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7226676Abstract: An energy conversion system, comprising: a reservoir container including at least two chambers of inversely variable volume for respectively storing a quantity of fuel and receiving a quantity of exhaust; a means for decreasing the volume of the first chamber while concurrently increasing the volume of the second chamber; at least one energy conversion device; first means for communicating fuel between the at least one energy conversion device and a first of the chambers in the reservoir container; and second means for communicating exhaust between the at least one energy conversion device and a second of the chambers in the reservoir container. The reservoir container may be transported to a recharging/refilling station or recharged in-situ. A particular application for metal-air fuel cell power systems is shown and described.Type: GrantFiled: May 5, 2003Date of Patent: June 5, 2007Assignee: Reveo, Inc.Inventors: Sadeg M. Faris, Tsepin Tsai, Wenbin Yao, Yuen-Ming Chang
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Patent number: 7197204Abstract: Practical applications of a class of nematic elastomer which has light avoidance characteristics are disclosed. Such practical applications include a switching device, a load carrying device and programmable mask. The use of different light sources, including the use of an autonomous device are further disclosed.Type: GrantFiled: September 15, 2004Date of Patent: March 27, 2007Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7163826Abstract: A method for fabricating multi layer devices on a substrate with a buried oxide layer is disclosed. Multi layer microelectromechanical, microfluidic, and integrated circuit devices are fabricated on a substrate with layers of predetermined weak and strong bond regions with deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device.Type: GrantFiled: November 20, 2003Date of Patent: January 16, 2007Assignee: Reveo, IncInventor: Sadeg M. Faris
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Patent number: 7148513Abstract: A novel backlight is provided for a liquid crystal display (LCD). The backlight of this invention includes an organic electroluminescent (EOL) device and a cholesteric liquid crystal (CLC) polarizing device. This invention is also an LCD. The backlight of the present invention provides for highly efficiency and bright LCDs. This invention further provides for the production of ultra-thin and lightweight LCDs.Type: GrantFiled: June 20, 2001Date of Patent: December 12, 2006Assignee: Reveo, IncInventors: Zhan He, Sadeg M. Faris
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Patent number: 7145219Abstract: A method for fabricating a vertical integrated circuit is disclosed. Integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of integrated circuits are fabricated at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a vertical integrated circuit. An arbitrary number of layers can be bonded and stacked in to a separate vertical integrated circuit. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.Type: GrantFiled: December 23, 2004Date of Patent: December 5, 2006Assignee: Reveo, Inc.Inventor: Sadeg M Faris
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Patent number: 7116857Abstract: An optomechanical switch comprised of light or laser movable liquid crystal is disclosed. The optomechanical switch consists of a plate of light movable liquid crystal rotatably disposed with respect to a substrate. When activated with a light or laser source, the light movable liquid crystal is rotated angularly to create transmissive and reflective states of transmission for the optical beam.Type: GrantFiled: December 8, 2003Date of Patent: October 3, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7110052Abstract: A reconfigurable backlighting construction for use in portable computer-based systems having direct and projection viewing modes of operation is provided. These computer-based systems are capable of selectively displaying color video images on an actively driven display surface, or projecting such video images onto a wall surface or projection screen without the need for a bulky overhead projector, required by all prior art systems. These computer-based systems can be easily reconfigured for projection viewing without physical removal of the light guiding panel and its light diffusing structures. A portable light projection accessory device is also provided for use with the portable computer-based systems of the present invention.Type: GrantFiled: August 14, 1998Date of Patent: September 19, 2006Assignee: Reveo, Inc.Inventors: Sadeg M. Faris, Carl Tung
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Patent number: 7081657Abstract: The present invention relates to micro electro-mechanical systems (MEMS) and production methods thereof, and more particularly to vertically integrated MEMS systems. Manufacturing of MEMS and vertically integrated MEMS is facilitated by forming, preferably on a wafer level, plural MEMS on a MEMS layer selectively bonded to a substrate, and removing the MEMS layer intact.Type: GrantFiled: March 4, 2004Date of Patent: July 25, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7075104Abstract: A novel method of manufactring a microchannel plate (“MCP”) is disclosed. The method comprises the steps of ion implantation of a substrate, the subsequent formation of channels paterned on the surface of the substrate and bonding of the subsequent substrate to a handle wafer. The layers are subsequently cleaved and the steps repeated until a MCP structure is achieved. The resulting MCP structure is cost-effective as compared to conventional manufacturing processes and the resulting MCP structure exhibits a funneling effect. The MCP structure may also be used for optical signal amplification for a biochip array.Type: GrantFiled: March 12, 2004Date of Patent: July 11, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7056751Abstract: A method for increasing the manufacturing yield for a vertically integrated device is disclosed. The devices are composed of one or more multiple layer die. The number of functioning layers of each multiple layer die is determined diagnostically. Each of said multiple layer die are sorted based on said number of functioning layers. Also disclosed are methods for combining sorted die, and methods for slicing sorted die, to form die with a desired number of known good layers.Type: GrantFiled: November 20, 2003Date of Patent: June 6, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7045878Abstract: A layered structure generally includes a first layer suitable for having a useful element formed therein or thereon selectively attached or bonded to a second layer. A method to form a layered structure generally comprises selectively adhering a first substrate to a second substrate.Type: GrantFiled: September 12, 2001Date of Patent: May 16, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7033910Abstract: A method for fabricating multi layer microelectromechanical and microfluidic devices is disclosed. Multi layer microelectromechanical and microfluidic devices are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device. Also disclosed are methods of creating edge interconnects and vias through the substrate to form interconnections between layers and devices thereon.Type: GrantFiled: November 19, 2003Date of Patent: April 25, 2006Assignee: Reveo, Inc.Inventor: Sadeg M. Faris
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Patent number: 7034909Abstract: Disclosed are super broadband circularly polarizing film materials and novels methods of fabricating and using the same. The circularly polarizing materials are made from a film of material, such as a CLC polymer having a cholesteric order, in which a liquid crystal material, such as a nematic liquid crystal material, is distributed in a non-linear fashion across the thickness of the film in a plurality of liquid crystal-rich and liquid crystal-depleted sites in the CLC polymer. The pitch of the helices of the CLC molecules in the polyermized CLC material varies in a non-linear (e.g. exponential) manner along the depth dimension (i.e. transverse to the surface) thereof. The resulting circularly polarizing materials have reflection and transmission characteristics over bands of operation approaching 2000 nm. Depending on the final spiral structure of the materials utilized, the CLC circularly polarizing materials reflect either left-handed or right-handed circularly polarized light.Type: GrantFiled: July 9, 2004Date of Patent: April 25, 2006Assignee: Reveo, Inc.Inventors: Sadeg M. Faris, Le Li, Yingqiu Jiang