Patents Assigned to ReVera Incorporated
  • Nondestructive characterization of thin films based on acquired spectrum
    Patent number: 6891158
    Abstract: The present invention provides for characterization of a film (e.g., thickness determination for a silicon oxynitride film) using collected spectral data. For example, an acquired spectrum may be cumulatively integrated and the geometric properties of the integrated spectrum may be used to determine component concentration information. Thickness measurements for the film may be provided based on the component concentration information.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: May 10, 2005
    Assignee: ReVera Incorporated
    Inventors: Paul E. Larson, David G. Watson
  • Nondestructive characterization of thin films using measured basis spectra
    Patent number: 6800852
    Abstract: The present invention provides for characterization of a film (e.g., thickness determination for a silicon oxynitride film) using a comparison process (e.g., a fitting process) to compare measured peak shapes for elemental and/or chemical species (e.g., Si peak shapes previously measured for a particular process to be monitored) to collected spectral data (e.g., using a non-linear least squares fitting algorithm).
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: October 5, 2004
    Assignee: ReVera Incorporated
    Inventors: Paul E. Larson, David G. Watson, John F. Moulder