Patents Assigned to RF Link Co., Ltd
  • Publication number: 20100084473
    Abstract: The present invention relates to a radio frequency identification tag having high thermal resistance for metal products and method of manufacturing thereof. The radio frequency identification tag according to the present invention comprises a printed circuit board made of epoxy glass; an antenna pattern and a transponder chip disposed on the upper surface of the printed circuit board; a first thermal resistant ink layer coated on the antenna pattern on the printed circuit board; a metal shielding layer attached to a lower surface of the printed circuit board; a second thermal resistant ink layer coated on the lower surface of the metal shielding layer; and an adhesive layer applied to the second thermal resistant ink layer, wherein a transponder chip protection layer made of thermal resistant is formed on the transponder chip.
    Type: Application
    Filed: January 19, 2006
    Publication date: April 8, 2010
    Applicant: RF Link Co., Ltd
    Inventor: Kwang-il Choi