Abstract: Solderless RF power film resistor and termination assemblies which include a flat film resistor or termination pressed by a nonmetallic clamping plate into thermal contact with a base plate functioning as a heat sink. A substrate such as a BeO ceramic substrate provides an RF power film resistor or termination, and has a flat mounting surface positioned against a flat mounting surface of the base plate. A clamping plate clamps the ceramic substrate securely against the base plate, thereby eliminating a soldered interface connection between the flat mounting surfaces of the ceramic substrate and the base plate. The clamping plate includes at least one lug, and the base plate includes at least one lug hole. The lug is larger than, and is plastically deformed into and through the hole to clamp the flat surface of the ceramic substrate securely against the flat surface of the base plate. The hole in the base plate preferably includes an undercut shoulder through and around which the lug is plastically deformed.