Abstract: The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate (6) which carries an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7-4) and two contact terminals (8-1, 8-2); providing a bridge (5) having a dielectric bridge substrate (1) and a chip (3) having an integrated circuit; and placing said bridge (5) with said chip (3) onto said dielectric antenna substrate (6) so that the bridge (5) straddles said at least one turn (7-1, 7-2, 7-3, 7-4) and forms an electric connection between said chip (3) and said antenna circuit (7). The invention is particularly useful for HF RFID objects.

Abstract: The invention relates to portable electronic objects comprising an integrated circuit chip, and a mounting having two connection terminals for a circuit, as well as to a method for manufacturing such objects. The invention is characterized in that the chip is provided, on the active surface thereof, with two widened connection zones, in particular connection plates, said connection plates being positioned opposite said terminals and electrically connected, by ohmic contact, to the latter, and in that the surface defined by the connection plates, at the surface of the active integrated circuit having said plates, is greater than ½ of the surface of said surface. The invention can be used, in particular, for RFID objects.

Abstract: The invention relates to a method for manufacturing contactless portable objects having an integrated circuit, and to contactless portable objects having an integrated circuit. The method of the invention is characterized in that it comprises the following steps: providing a dielectric antenna substrate (6) which carries an antenna circuit (7) having at least one turn (7-1, 7-2, 7-3, 7-4) and two contact terminals (8-1, 8-2); providing a bridge (5) having a dielectric bridge substrate (1) and a chip (3) having an integrated circuit; and placing said bridge (5) with said chip (3) onto said dielectric antenna substrate (6) so that the bridge (5) straddles said at least one turn (7-1, 7-2, 7-3, 7-4) and forms an electric connection between said chip (3) and said antenna circuit (7). The invention is particularly useful for HF RFID objects.