Abstract: A solar panel including N panel sections and individual bypass diodes for each panel section includes a panel bypass diode connected in parallel with and in opposite polarity to the solar panel. The solar panel may further include one or more group bypass diodes when the solar panel includes three or more panel sections. Each group bypass diode is connected across a group of M adjacent panel sections, M being selected from 2 to N?1. The group bypass diode is connected in parallel with and in opposite polarity to the group of M adjacent panel sections. A group bypass diode is fully forward biased to conduct current through the solar panel when the associated group of M adjacent panel sections experience performance degradation. The panel bypass diode is fully forward biased to conduct current through the solar panel when the N panel sections experience performance degradation.

Abstract: An electronic device with an embedded wireless tag may be authenticated by a linking partner, which may be another electronic device or a data network, before network connection can be established. In some embodiments, the electronic device includes an embedded wireless communicator for communicating with the wireless tag through a wireless link to retrieve identification data for authentication. In other embodiments, the electronic device cooperates with an external wireless communicator to retrieve stored identification data from the embedded wireless tag. In alternate embodiments, an electronic device may authenticate a peripheral device with an embedded wireless tag before connection can be established with the peripheral device. The electronic device may further erase the data stored on the peripheral device when authentication fails.

Abstract: In one embodiment, a structure includes a semiconductor chip including a communication element for performing a wireless communication function where the communication element has a communication core occupying a region of the semiconductor chip, a plurality of chip pads with two of the chip pads electrically connected to the communication core; a chip carrier for carrying the semiconductor chip where the chip carrier includes a plurality of carrier pads with two of the carrier pads connected to the two chip pads; and an antenna connected to the carrier pads and electrically connected to the chip pads and to the communication core.

Abstract: A wireless device includes a controller and a wireless transceiver where the controller is operative to place the wireless transceiver in a low power consumption mode based on predefined energy saving control policy. In one embodiment, the wireless device includes an accelerometer generating an output signal indicative of motion or vibration of the wireless device where the output signal of the accelerometer is applied to cause the wireless transceiver to exit from the low power consumption mode. In another embodiment, the wireless device includes a photovoltaic module generating an output voltage signal indicative of incident light impinging on the photovoltaic module where the output voltage signal of the photovoltaic module is applied to cause the wireless transceiver to exit from the low power consumption mode.

Abstract: A method for providing identity authentication and tracking for a multi-chip package (MCP) module or a designated semiconductor chip formed inside a MCP module where the MCP module is provided with a first communication function includes providing a communication element formed on the MCP base where the communication element includes a memory unit for storing identification information; providing an electrical connection between the communication element and the designated semiconductor chip; accessing by the designated semiconductor chip the information stored in the memory unit of the communication element through the electrical connection; and providing the information stored in the communication element to a system outside of the MCP module through the first communication function where the information is used at least to track or authenticate the MCP module or the designated semiconductor chip of the MCP module.

Abstract: In one embodiment, a wireless device is embedded in a solar panel for providing remote tracking and/or performance monitoring of the solar panel. The wireless device may be a wireless tracking device including a memory for storing the identification or identity information of the solar panel or of the individual solar cells forming the panel. The wireless device may be a wireless tracking and monitoring device to provide both tracking and performance monitoring functions. In another embodiment, the wireless device is affixed to the exposed side of the back sheet of the solar panel but within the junction box interface so that the wireless device is enclosed in the junction box housing. In other embodiments, some of the elements of the wireless device may be embedded in the solar panel while other elements are affixed to the exposed back sheet inside the junction box housing.

Abstract: In one embodiment, a wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate where the substrate includes one or more openings formed thereon. The opening in the substrate enables the flow of encapsulation material when the wireless tag is embedded into a semiconductor package. In another embodiment, a wireless tag is attached to the package substrate of a semiconductor package where the thin film substrate of the wireless tag has an opening sufficient to accommodate the integrated circuit die of the semiconductor package. In another embodiment, a wireless tag is formed using a metal film as the antenna and a wireless element attached to the metal film. The wireless tag is attached to the package substrate of a semiconductor package using a non-conductive adhesive. The metal film includes an opening sufficient to accommodate the die of the semiconductor package.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a flexible thin film substrate. The wireless tag is inserted into the packaging of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. In one embodiment, the wireless tag is affixed to a top surface of an integrated circuit chip before encapsulation or lid sealing operation of the packaging process. In this manner, the wireless communication device is embedded in the packaging of the microelectronic device and can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a flexible thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be embedded in the packaging of the microelectronic device. In one embodiment, the wireless tag is embedded in the packaging of a multi-chip package module housing one or more integrated circuits. In this manner, the wireless communication device can be used to track and authenticate the integrated circuits as well as the derivative system products incorporating the integrated circuits.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be affixed to a package lid of the microelectronic device. The wireless tag may further be affixed to a chip scale package or a three dimensional semiconductor package. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A semiconductor package includes a package body with a cavity housing a first integrated circuit die. A wireless tag including a wireless element and an antenna is embedded in the semiconductor package. In one embodiment, the antenna is embedded in the package body of the semiconductor package. In another embodiment, the antenna is formed on or in the first integrated circuit die housed in the semiconductor package. According to another aspect of the present invention, the semiconductor package may be mounted on a printed circuit board and a second antenna is formed on the printed circuit board in electrical connection to the antenna embedded in the semiconductor package.

Abstract: A wireless tag includes a wireless transceiver, a memory and an antenna all formed on a thin film substrate. The wireless tag is inserted into the packaging material of a microelectronic device to implement tracking and authentication functions. In some embodiments, the wireless communication device stores identity or other identification information for the microelectronic device, and/or the derivative system product incorporating the microelectronic device. The wireless tag may be embedded in the encapsulation materials of the microelectronic device. The wireless tag may also be embedded in the package filler material of the microelectronic device. In this manner, the wireless communication device can be used to track and authenticate the microelectronic device as well as the derivative system products incorporating the microelectronic device.

Abstract: A management system for tracking elements through steps and stages of a chain employing fixed tags permanently attached to elements that progress through the steps and stages. The elements are tracked by the fixed tags from an initial stage, through multiple work-in-process stages to a final stage of the chain. The fixed tags include radio-frequency (RF) communication units that have wireless communication with RF communicators in one or more of the stages of the supply chain. The wireless communications between the RF tags and the RF communicators operate with a tag communication protocol that defines the operations and sequences for storing information into and retrieval of information from tags. The hierarchy of data storage in RF tags, in RF communicators and otherwise in storage locations in the system is controlled to operate within the memory hierarchy.