Abstract: A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.

Abstract: A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.

Abstract: A method of brazing components of a heat sink module is described. The method may include the steps of assembling the components to be brazed, and placing a copper-silver alloy filler at junctions between the components. The assembled components may be pre-heated in an air-tight environment to burn up most of the oxygen present, and then heated to the melting point of the copper-silver alloy filler in an air-tight environment having an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, making the filler melt and evenly spread over the gaps at the junctions of the components. The assembled components may then be cooled to solidify the liquid filler at the junctions, to form a finished product. Also, an assembly line system for brazing the components of a heat sink module is described.