Abstract: A testing arrangement for a printed circuit board includes a carrier for a multiplicity of contact pins which engage the ends of the printed conductors on the printed circuit board. The carrier is positioned above a base which receives a multiplicity of leads connected with a device for testing the printed circuit board. The leads, which are to be connected with respective ones of the contact pins, engage sockets mounted in the base. The connections between the contact pins and the leads are established via a sheet which is located intermediate the base and the carrier and is provided with contacts in the form of thin foils. The contacts face and engage respective ones of the contact pins. The contacts are connected with plugs which are mounted on the intermediate sheet and are inserted into the sockets in the base.