Patents Assigned to RICHVIEW ELECTRONICS CO., LTD.
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Patent number: 11917768Abstract: A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.Type: GrantFiled: January 25, 2022Date of Patent: February 27, 2024Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 11552617Abstract: A microwave dielectric component (100) comprises a microwave dielectric substrate (101) and a metal layer, the metal layer being bonded to a surface of the microwave dielectric substrate (101). The metal layer comprises a conductive seed layer and a metal thickening layer (105). The conductive seed layer comprises an ion implantation layer (103) implanted into the surface of the microwave dielectric substrate (101) and a plasma deposition layer (104) adhered on the ion implantation layer (103). The metal thickening layer (105) is adhered on the plasma deposition layer (104). A manufacturing method of the microwave dielectric component (100) is further disclosed.Type: GrantFiled: March 15, 2018Date of Patent: January 10, 2023Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Zhijian Wang, Honglin Song, Xianglan Wu, Siping Bai
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Publication number: 20220151081Abstract: A multi-layer circuit board, successively constituted by surface sticking layer, single-layer circuit board, middle sticking layer, single-layer circuit board, surface sticking layer, said multi-layer circuit board is provided with a hole, a hole wall of said hole is formed with conductive seed layer, and partial outer surface of said surface sticking layer is formed with a circuit pattern layer of conductive seed layer, wherein said conductive seed layer comprises a ion implantation layer implanting below the hole wall of said hole and below partial outer surface of said surface sticking layer.Type: ApplicationFiled: January 25, 2022Publication date: May 12, 2022Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 11266027Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: GrantFiled: June 25, 2020Date of Patent: March 1, 2022Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 11032915Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: GrantFiled: June 25, 2020Date of Patent: June 8, 2021Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Publication number: 20200344895Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: ApplicationFiled: June 25, 2020Publication date: October 29, 2020Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Publication number: 20200329567Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board comprises the following steps: drilling a hole on a substrate, the hole comprising a blind hole and/or a through hole; on a surface of the substrate, forming a photoresist layer having a circuit negative image; forming a conductive seed layer on the surface of the substrate and a hole wall of the hole; removing the photoresist layer, and forming a circuit pattern on the surface of the substrate, wherein forming a conductive seed layer comprises implanting a conductive material below the surface of the substrate and below the hole wall of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: ApplicationFiled: June 25, 2020Publication date: October 15, 2020Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 10757820Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: GrantFiled: April 11, 2019Date of Patent: August 25, 2020Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 10757821Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: GrantFiled: April 11, 2019Date of Patent: August 25, 2020Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Publication number: 20190306991Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: ApplicationFiled: April 11, 2019Publication date: October 3, 2019Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Publication number: 20190239363Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: ApplicationFiled: April 11, 2019Publication date: August 1, 2019Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 10321581Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: GrantFiled: November 23, 2016Date of Patent: June 11, 2019Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Publication number: 20180324958Abstract: A single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor. The method for manufacturing the single-layer circuit board (10) comprises the following steps: drilling a hole on a substrate (11), the hole comprising a blind hole and/or a through hole (S1); on a surface (12) of the substrate, forming a photoresist layer having a circuit negative image (S2); forming a conductive seed layer on the surface (12) of the substrate and a hole wall (19) of the hole (S3); removing the photoresist layer, and forming a circuit pattern on the surface (12) of the substrate (S4), wherein Step S3 comprises implanting a conductive material below the surface (12) of the substrate and below the hole wall (19) of the hole via ion implantation, and forming an ion implantation layer as at least part of the conductive seed layer.Type: ApplicationFiled: November 23, 2016Publication date: November 8, 2018Applicant: RICHVIEW ELECTRONICS CO., LTD.Inventors: Siping Bai, Xianglan Wu, Zhijian Wang, Zhigang Yang, Jinqiang Zhang
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Patent number: 9587318Abstract: Method for continuously producing flexible copper clad laminates includes performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film, and performing continuous copper plating. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.Type: GrantFiled: May 10, 2011Date of Patent: March 7, 2017Assignee: RICHVIEW ELECTRONICS CO., LTD.Inventors: Xinlin Xie, Nianqun Yang
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Publication number: 20130228468Abstract: The present invention provides a method for continuously producing flexible copper clad laminates, which comprises a step of performing continuous copper plating after the steps or step of performing continuous ion implantation and/or plasma deposition on the surface of an organic macromolecular polymer film. The bonding force between the copper film and the substrate in a two-layer flexible copper clad laminate produced by the method provided by the present invention is much larger than that in a flexible copper clad laminate produced by a sputtering/plating method and equivalent to that in a flexible copper clad laminate produced by a coating method and a lamination method. Meanwhile the thickness of the copper film can be easily controlled to be less than 18 microns.Type: ApplicationFiled: May 10, 2011Publication date: September 5, 2013Applicant: ZHUHAI RICHVIEW ELECTRONICS CO., LTD.Inventors: Xinlin Xie, Nianqun Yang