Patents Assigned to Ricoh Microelectronics, Company, Ltd.
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Patent number: 7539751Abstract: A media information distribution and recording system for distributing media information from a central apparatus to terminal apparatus through a network and for recording the media information on a detachable recording medium in the terminal apparatus, wherein the terminal apparatus serves not only as a transmitting terminal apparatus, but also as a receiving terminal apparatus, is proposed, together with the terminal apparatus, a media information recording apparatus for use in this system, and a recording medium which stores a program that controls the operation of a computer for use in this system as well as in the media information recording apparatus.Type: GrantFiled: December 22, 2004Date of Patent: May 26, 2009Assignee: Ricoh Microelectronics, Company, Ltd.Inventors: Masami Yamashita, Kenji Katsuhara
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Patent number: 6853985Abstract: A media information distribution and recording system for distributing media information from a central apparatus to terminal apparatus through a network and for recording the media information on a detachable recording medium in the terminal apparatus, wherein the terminal apparatus serves not only as a transmitting terminal apparatus, but also as a receiving terminal apparatus, is proposed, together with the terminal apparatus, a media information recording apparatus for use in this system, and a recording medium which stores a program that controls the operation of a computer for use in this system as well as in the media information recording apparatus.Type: GrantFiled: February 16, 2000Date of Patent: February 8, 2005Assignee: Ricoh Microelectronics, Company, Ltd.Inventors: Masami Yamashita, Kenji Katsuhara
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Patent number: 6501667Abstract: A data writing system capable of writing data in at least one electrically rewritable ROM mounted on target board, comprising: a transportation unit for transporting the target board to a predetermined writing position at which data is to be written, a data writing unit for writing data in the ROM mounted on the target board, and a connection unit for electrically connecting the ROM mounted on the target board at the predetermined writing position with the data writing unit through at least one transmission line extending from the ROM.Type: GrantFiled: July 3, 2001Date of Patent: December 31, 2002Assignee: Ricoh Microelectronics Company, Ltd.Inventors: Hiroyuki Yasugi, Junichi Kawakami, Shuhei Abe, Koji Mantani
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Publication number: 20020073271Abstract: A data writing system capable of writing data in at least one electrically rewritable ROM mounted on target board, comprising:Type: ApplicationFiled: July 3, 2001Publication date: June 13, 2002Applicant: RICOH MICROELECTRONICS COMPANY, LTD.Inventors: Hiroyuki Yasugi, Junichi Kawakami, Shuhei Abe, Koji Mantani
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Patent number: 6346687Abstract: An energy beam method and apparatus for processing a workpiece is accomplished by making the energy density per unit time and unit area of the energy beam proportional to the traveling velocity of the workpiece. This is accomplished by adjusting the frequency, irradiation power, or duty cycle of the energy beam. The travel velocity of the workpiece is measured by using a linear scale to generate pulse signals, calculating a traveling velocity based on the pulse signals and generating a pulse signal, dividing the pulse signals output by the calculation step, and generating a trigger signal in response to the pulse signals created by the dividing step to drive an energy beam irradiation device (such as a laser generator) to output the energy beam.Type: GrantFiled: February 18, 1999Date of Patent: February 12, 2002Assignee: Ricoh Microelectronics Company, Ltd.Inventors: Makoto Kinoshita, Takeshi Kobayashi
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Patent number: 6300594Abstract: A method and apparatus for machining an electrically conductive film at a low cost, suitable for multi-product small-amount production are provided to reduce variations in resulting dimensions, a partially remaining conductive film, damage to an insulating substrate, and so on after machining, while eliminating the need for a waste liquid treatment. The apparatus includes a YAG laser for emitting near infrared light (at wavelength &lgr;=1064 nm), an optical system including a step index optical fiber for guiding the laser light emitted from the laser to the vicinity of an electrically conductive film on an insulating transparent substrate, an X-Y stage having a carrier for carrying the transparent substrate thereon, and a controller for controlling and driving the X-Y stage to move the transparent substrate in a direction orthogonal to a direction in which the laser light is irradiated. Instead of the optical fiber, a kaleidoscope may be used.Type: GrantFiled: February 18, 1999Date of Patent: October 9, 2001Assignee: Ricoh Microelectronics Company, Ltd.Inventors: Makoto Kinoshita, Takeshi Kobayashi
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Patent number: 6288830Abstract: An optical image forming method and device, an image forming apparatus, and an aligner for lithography, capable of forming a light image at a high pixel density and enhancing the intensity of irradiated light to each pixel by effectively utilizing reflected light from respective mirrors of a spatial light modulator. The optical image forming device has a light source, a DMD including a plurality of mirrors, each capable of independently controlling the inclination of a reflecting surface thereof for reflecting light from the light source, wherein reflected light from the DMD is irradiated to an object moving in one direction relative to the reflected light to form a light image on the object. The respective mirrors of the DMD are arranged such that reflected light images therefrom are aligned on the object in a direction orthogonal to the direction of the relative movement, with a pitch smaller than the pitch p of the mirrors.Type: GrantFiled: May 12, 1999Date of Patent: September 11, 2001Assignee: Ricoh Microelectronics Company, Ltd.Inventor: Makoto Kinoshita
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Publication number: 20010007171Abstract: A method of producing a nozzle plate for use in an ink jet head includes the steps of (a) stretching a predetermined number of resin lines, each having a cross section corresponding in shape to each nozzle hole to be formed in an ink jet head, in the same arrangement as that of nozzle holes to be formed in the ink jet head, (b) plating the peripheral surface of each of the resin lines with a metal, while maintaining the arrangement of the resin lines, (c) forming a nozzle substrate so as to include the resin lines therein with the metal used in the plating of the resin lines, (d) slicing the nozzle substrate, and (e) removing the resin lines from the sliced nozzle substrate, thereby forming the nozzle plate. In the above method, the resin lines can be removed from the nozzle substrate, and then the nozzle substrate can be sliced so as to form the nozzle plate.Type: ApplicationFiled: January 22, 2001Publication date: July 12, 2001Applicant: RICOH MICROELECTRONICS COMPANY, LTD.Inventor: Makoto Kinoshita
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Patent number: 6256883Abstract: A method of producing a nozzle plate for use in an ink jet head includes the steps of (a) stretching a predetermined number of resin lines, each having a cross section corresponding in shape to each nozzle hole to be formed in an ink jet head, in the same arrangement as that of nozzle holes to be formed in the ink jet head, (b) plating the peripheral surface of each of the resin lines with a metal, while maintaining the arrangement of the resin lines, (c) forming a nozzle substrate so as to include the resin lines therein with the metal used in the plating of the resin lines, (d) slicing the nozzle substrate, and (e) removing the resin lines from the sliced nozzle substrate, thereby forming the nozzle plate. In the above method, the resin lines can be removed from the nozzle substrate, and then the nozzle substrate can be sliced so as to form the nozzle plate.Type: GrantFiled: May 28, 1999Date of Patent: July 10, 2001Assignee: Ricoh Microelectronics Company, Ltd.Inventor: Makoto Kinoshita
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Patent number: 6225205Abstract: A method of forming a plurality of bump electrodes en bloc on a bump electrode formation surface of a wafer from which chips are to be separated, or on an upper surface of a plurality of chips which are separated from a wafer and placed side by side, the upper surface constituting a bump electrode formation surface, is disclosed.Type: GrantFiled: January 21, 1999Date of Patent: May 1, 2001Assignee: Ricoh Microelectronics Company, Ltd.Inventor: Makoto Kinoshita