Abstract: Automated apparatus transfers SMDs with leads for contacting mounting pad surfaces of surface mount PCBs from containers to nests on a rotatable dial, such that the nests support the SMDs by the leads without touching the body of an SMD. At a test station an elevator device elevated the nest to place an SMD in the nest in a test socket positioned above the dial so the SMD leads connect to test circuitry through contacts in the test socket. In a preferred embodiment the test socket is the base of a manual insert test socket and the nest performs the function of the lid of a manual insert test socket.