Patents Assigned to Rini Technologies, Inc.
  • Patent number: 11047381
    Abstract: The subject invention pertains to a method and apparatus for an orientation independent compressor. The subject compressor can be part of a vapor compression cycle system, and can use one or more of a variety of working fluids, including, but not limited to, refrigerants such as r-134a, r-22, CO2, and NH3. Embodiments of the compressor can utilize positive displacement apparatus to compress the vapor. In a specific embodiment, the compressor can incorporate an oil-lubricated rotary lobed type positive displacement compressor. In a further specific embodiment, the working fluid vapor can be a refrigerant, such as r-134a, incorporating entrained oil, such as miscible lubricating oils. An example of such a miscible lubricating oil that can be used is polyester (POE) oil.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: June 29, 2021
    Assignee: RINI TECHNOLOGIES, INC.
    Inventors: Daniel P. Rini, Benjamin Saarloos, Brian Zinck, Nick Williams, James Hughes
  • Patent number: 9612061
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Grant
    Filed: January 7, 2008
    Date of Patent: April 4, 2017
    Assignee: RINI TECHNOLOGIES, INC.
    Inventors: Daniel P. Rini, Louis Chow
  • Patent number: 8371134
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: February 12, 2013
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 8104533
    Abstract: The subject invention pertains to a spray nozzle apparatus and method of use. The subject spray nozzle can be used to spray atomized fluid. The atomized fluid can then be incident on a heated surface such that heat is transferred from the heated surface to the atomized fluid. The subject invention also relates to a spray-cooling system and method of use. The subject spray-cooling system can incorporate a spray nozzle and a heat transfer plate. A device to be cooled, such as a laser diode, microwave amplifier, or other high power electrical device, can be placed in direct thermal contact with the heat transfer plate. The spray from the spray nozzle can then be sprayed onto the heat transfer plate. In a specific embodiment, a cellular transfer plate can be used and the spray from the spray nozzle can be sprayed into a cellular cavity or compartment, within the heat transfer plate. Heat is transferred from the heat source to the sprayed liquid via the wall of the heat transfer plate.
    Type: Grant
    Filed: September 24, 2008
    Date of Patent: January 31, 2012
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Guochang Zhao
  • Patent number: 8100169
    Abstract: The subject invention pertains to a spray nozzle apparatus and method of use. The subject spray nozzle can be used to spray atomized fluid. The atomized fluid can then be incident on a heated surface such that heat is transferred from the heated surface to the atomized fluid. The subject invention also relates to a spray-cooling system and method of use. The subject spray-cooling system can incorporate a spray nozzle and a heat transfer plate. A device to be cooled, such as a laser diode, microwave amplifier, or other high power electrical device, can be placed in direct thermal contact with the heat transfer plate. The spray from the spray nozzle can then be sprayed onto the heat transfer plate. In a specific embodiment, a cellular transfer plate can be used and the spray from the spray nozzle can be sprayed into a cellular cavity or compartment, within the heat transfer plate. Heat is transferred from the heat source to the sprayed liquid via the wall of the heat transfer plate.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: January 24, 2012
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Guochang Zhao
  • Patent number: 8024942
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: December 21, 2007
    Date of Patent: September 27, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7942642
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: May 17, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7921664
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: March 11, 2008
    Date of Patent: April 12, 2011
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
  • Publication number: 20100132382
    Abstract: The subject invention pertains to a method and apparatus for an orientation independent compressor. The subject compressor can be part of a vapor compression cycle system, and can use one or more of a variety of working fluids, including, but not limited to, refrigerants such as r-134a, r-22, CO2, and NH3. Embodiments of the compressor can utilize positive displacement means to compress the vapor. In a specific embodiment, the compressor can incorporate an oil-lubricated rotary lobed type positive displacement compressor. In a further specific embodiment, the working fluid can be a refrigerant, such as r-134a, incorporating entrained oil, such as miscible lubricating oils. An example of such a miscible lubricating oil that can be used is polyester (POE) oil.
    Type: Application
    Filed: November 17, 2009
    Publication date: June 3, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Benjamin Saarloos, Brian Zinck, Nick Williams, James Hughes
  • Publication number: 20100071390
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Publication number: 20100071389
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Application
    Filed: June 30, 2009
    Publication date: March 25, 2010
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7654100
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: December 16, 2005
    Date of Patent: February 2, 2010
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow, Bradley G. Carman, Benjamin A. Saarloos
  • Publication number: 20090294097
    Abstract: Embodiments of the subject invention pertain to a method and apparatus for heating or cooling. Embodiments relate to a method and apparatus utilizing a vapor compression cycle to accomplish active heating or cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient heating or cooling system for underwater applications. The subject system can provide heating or cooling stress relief to individuals operating under, for example, hazardous conditions, or in low temperature underwater environments where passive protective clothing provides insufficient mitigation of cooling stress. Further embodiments can be utilized to provide heat stress relief to users who are working in thermally encapsulated ensembles that hinder the body's natural ability to expel heat. The subject system can be utilized in other applications that can benefit from this type of heating or cooling system.
    Type: Application
    Filed: February 6, 2009
    Publication date: December 3, 2009
    Applicant: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Benjamin A. Saarloos, Jose Mauricio Recio, James R. Hughes
  • Patent number: 7318325
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: January 15, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 7316262
    Abstract: The subject invention pertains to a method and apparatus for storing thermal energy. The subject thermal energy storage apparatus can function as a heat absorber in a cooling system. A cooling system can incorporate a cooling cycle that utilizes thermal energy storage and has two coolant loops. The primary cooling loop acquires the waste heat from a heat source, such as an electronic device, by heat transfer to the primary coolant via, for example, a sensible heat process (where sensible heat is heat absorbed or transmitted by a substance during a change in temperature which is not accompanied by a change of state) or by evaporating the primary coolant through a latent heat phase change process. The waste heat absorbed by the primary coolant is transferred to the host material of the heat absorber.
    Type: Grant
    Filed: January 26, 2005
    Date of Patent: January 8, 2008
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow
  • Patent number: 7010936
    Abstract: The subject invention pertains to a method and apparatus for cooling. In a specific embodiment, the subject invention relates to a lightweight, compact, reliable, and efficient cooling system. The subject system can provide heat stress relief to individuals operating under, for example, hazardous conditions, or in elevated temperatures, while wearing protective clothing. The subject invention also relates to a condenser for transferring heat from a refrigerant to an external fluid in thermal contact with the condenser. The subject condenser can have a heat transfer surface and can be designed for an external fluid, such as air, to flow across the heat transfer surface and allow the transfer of heat from heat transfer surface to the external fluid. In a specific embodiment, the flow of the external fluid is parallel to the heat transfer surface.
    Type: Grant
    Filed: July 22, 2003
    Date of Patent: March 14, 2006
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, Louis Chow, H. Randolph Anderson, Jayanta Sankar Kapat, Bradley Carman, Brian Gulliver, Jose Mauricio Recio
  • Patent number: 6993926
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: January 22, 2003
    Date of Patent: February 7, 2006
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow
  • Patent number: 6571569
    Abstract: The subject invention pertains to a method and apparatus for high heat flux heat transfer. The subject invention can be utilized to transfer heat from a heat source to a coolant such that the transferred heat can be effectively transported to another location. Examples of heat sources from which heat can be transferred from include, for example, fluids and surfaces. The coolant to which the heat is transferred can be sprayed onto a surface which is in thermal contact with the heat source, such that the coolant sprayed onto the surface in thermal contact with the heat absorbs heat from the surface and carries the absorbed heat away as the coolant leaves the surface. The surface can be, for example, the surface of an interface plate in thermal contact with the heat source or a surface integral with the heat source. The coolant sprayed onto the surface can initially be a liquid and remain a liquid after absorbing the heat, or can in part or in whole be converted to a gas or vapor after absorbing the heat.
    Type: Grant
    Filed: April 2, 2002
    Date of Patent: June 3, 2003
    Assignee: Rini Technologies, Inc.
    Inventors: Daniel P. Rini, H. Randolph Anderson, Jayanta Sankar Kapat, Louis Chow