Patents Assigned to Rising Silicon, Inc.
  • Patent number: 8097872
    Abstract: An apparatus and method for storing information are provided, including using an integrated circuit including a transistor having a channel, a gate oxide layer, a gate electrode, and a modifiable gate stack layer. To store information, the on-resistance of the transistor is changed by causing a non-charge-storage based physical change in the modifiable gate stack layer.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: January 17, 2012
    Assignee: Rising Silicon, Inc.
    Inventor: Franz Kreupl
  • Patent number: 7910210
    Abstract: In a method of producing a layer arrangement, a substantially carbon-comprising, electrically conductive carbon layer is formed. A protective layer is formed on the carbon layer. An electrically insulating layer is formed on the protective layer, the protective layer protecting the carbon layer from damage during the formation of the electrically insulating layer. Furthermore, a layer arrangement is provided, having a substantially carbon-comprising, electrically conductive carbon layer, a protective layer formed on the carbon layer, and an electrically insulating layer formed on the protective layer, the protective layer being used to avoid damage to the carbon layer by the electrically insulating layer.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: March 22, 2011
    Assignee: Rising Silicon, Inc.
    Inventors: Franz Kreupl, Maik Liebau, Georg Duesberg, Christian Kapteyn
  • Patent number: 7881092
    Abstract: An integrated circuit including a resistive memory element and a method of manufacturing the integrated circuit are described. The method of manufacturing the integrated circuit includes depositing a switching layer material and intentionally forming inhomogeneously distributed defects within the switching layer material to increase a number of switching cycles of the resistive memory element. The resistive memory element includes a switching layer that selectively switches between a low resistance state and a high resistance state. The switching layer contains intentionally formed defects that increase the number of switching cycles of the switching layer.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: February 1, 2011
    Assignee: Rising Silicon, Inc.
    Inventor: Klaus Ufert
  • Patent number: 7701743
    Abstract: An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
    Type: Grant
    Filed: August 7, 2008
    Date of Patent: April 20, 2010
    Assignee: Rising Silicon, Inc.
    Inventors: Nobuyasu Kanekawa, Hirokazu Ihara, Masatsugu Akiyama, Kiyoshi Kawabata, Hisayoshi Yamanaka, Tetsuya Okishima
  • Patent number: 7688670
    Abstract: A synchronous DRAM is provided which includes arrangements for operations of power supply circuitry based upon whether the DRAM is in a power down mode or not. In one embodiment, a first power supply circuit and a second power supply circuit are provided which both receive externally supplied voltages and output internal supply voltages. The first power supply circuit is not in operation when a semiconductor device of the synchronous DRAM is in a power down mode. However, the second power supply circuit is continuously in operation during the power down mode. In another arrangement, the operation of a voltage limiter circuit is controlled based on whether or not the DRAM is in a power down mode.
    Type: Grant
    Filed: July 1, 2008
    Date of Patent: March 30, 2010
    Assignee: Rising Silicon, Inc.
    Inventors: Masashi Horiguchi, Masayuki Nakamura, Sadayuki Ohkuma, Kazuhiko Kajigaya, Yoshinobu Nakagome
  • Patent number: RE41379
    Abstract: A semiconductor memory such as a dynamic RAM having memory mats each divided into a plurality of units or sub-memory mats. Each sub-memory mat comprises: a memory array having sub-word lines and sub-bit lines intersecting orthogonally and dynamic memory cells located in lattice fashion at the intersection points between the intersecting sub-word and sub-bit lines; a sub-word line driver including unit sub-word line driving circuits corresponding to the sub-word lines; a sense amplifier including unit amplifier circuits and column selection switches corresponding to the sub-bit lines; and sub-common I/O lines to which designated sub-bit lines are connected selectively via the column selection switches. The sub-memory mats are arranged in lattice fashion.
    Type: Grant
    Filed: June 7, 2007
    Date of Patent: June 15, 2010
    Assignee: Rising Silicon, Inc.
    Inventors: Tsugio Takahashi, Goro Kitsukawa, Takesada Akiba, Yasushi Kawase, Masayuki Nakamura