Abstract: A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has a container holding an etchant solution, a pump having an inlet port connected to the container holding an etchant solution, and an outlet port, a heat exchanger having an inlet port connected to the pump outlet port, and an outlet port from the heat exchanger, and control circuitry controlling temperature of the etchant to be at or below ambient temperature by controlling temperature of the heat exchanger.

Abstract: An inhibitor solution injector system for an IC decapsulation apparatus has a source reservoir of inhibitor solution, a fluid injection apparatus connected to the source reservoir by a fluid passage, an injection coupling having a first input passage for inhibitor solution, and a through passage for etchant solution, the input passage intersecting with the through passage, and control circuitry controlling the controlled fluid injection apparatus. The fluid injection apparatus is controlled to draw inhibitor solution from the source reservoir, and to inject inhibitor solution through the input passage into the through passage of the injection coupling.

Abstract: A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etching chamber at a low gas pressure, a f toggle mechanism mounted to a metal plate t, an etchant supply subsystem comprising sources of etchant solutions, an etchant solution pump, supply passages and controls to select etchants and etchant ratios, and a heat exchanger heating or cooling the etchant solution, etchant waste passages f conducting used etchant away. Etchants are mixed in the passages to the reaction region, and turbulence in the reaction region is promoted by impinging etchant solution on the encapsulated device.

Abstract: A system for decapsulating a portion of an encapsulated integrated circuit that includes copper elements has one or more containers holding specific etchant solutions, a pump having an inlet port connected to the one or more containers holding specific etchant solutions, and an outlet port, a temperature-controlled metal block having a fluid inlet connected to the pump outlet port, and an outlet port from the block, and control circuitry enabling control of temperature of the metal block and operation of the pump, and flow and temperature sensors coupled to the control circuitry. Etchant temperature at the outlet of the metal block is controlled to be at or below ambient temperature by controlling the pump and temperature of the metal block, and etchant mixture is delivered via a delivery conduit to an encapsulation surface of an encapsulated integrated circuit, decapsulating a portion of encapsulated circuit, minimizing damage to the copper elements.

Abstract: A decapsulation apparatus has an etch plate, an off-center etch head having an opening, a cover sealing to the etch plate forming an etching chamber, a gasket surrounding the opening, a ram sealed through the cover, a pressure-controlled source of Nitrogen or inert gas continuously purging the etching chamber at a low gas pressure, a f toggle mechanism mounted to a metal plate t, an etchant supply subsystem comprising sources of etchant solutions, an etchant solution pump, supply passages and controls to select etchants and etchant ratios, and a heat exchanger heating or cooling the etchant solution, etchant waste passages f conducting used etchant away. Etchants are mixed in the passages to the reaction region, and turbulence in the reaction region is promoted by impinging etchant solution on the encapsulated device.

Abstract: A method and system for decapsulating a portion of an encapsulated integrated circuit delivers etchant mixture in variable but precise, high-velocity micro-metered pulses to a single outlet port of a pump from any one of or a combination of separate inlet ports connected to separate etchant source containers holding specific etchant solutions, controls temperature of the etchant mixture by passing the etchant mixture from the outlet port through a serpentine passage in a temperature-controlled metal block, and delivers the etchant mixture from the serpentine passage of the temperature-controlled block via a delivery conduit to an encapsulation surface of the encapsulated integrated circuit.