Abstract: System and method for bonding a cap to a wafer. The method includes providing a wafer with an microelectromechanical system arranged thereon; providing a bond frame arranged on the outer perimeter of the wafer; and providing a transparent cap. A laser beam is projected through the transparent cap and impinges on the bond frame in a region adjacent to the transparent cap. The bond frame absorbs some or all of the laser energy and increases in temperature. The heat generated by the impinging laser beam is transferred from the bond frame to the adjacent cap, which is heated in excess of its melting temperature. The transparent cap melts in the region of the laser impinging on the bond frame and thereby bonds with the bond frame, creating a hermetic seal between the cap and the wafer. The MEMS sensor is thereby protected from the environment by the hermetically sealed cap. A MEMS device with an hermetically sealed cap or a BioMEMS device with a channel having rounded corners is provided.

Abstract: A method for monitoring a braking system contained in a vehicle. The braking system includes at least one brake circuit. The brake circuit, on the output side, contains valve configurations, to which wheel brake cylinders allocated to the brake circuit are connected. The braking system furthermore has at least one pump capable of delivering braking medium to at least two wheel brake cylinders. During predetermined vehicle states, the at least one pump is actuated and the first valve configurations are driven by predefined driving signals. Ascertained for at least one wheel of the vehicle during the actuation of the pump and the first valve configurations is a wheel-performance variable which describes the wheel performance, in particular the wheel-rotation performance, of the corresponding wheel. The braking system is checked for a first and/or second fault as a function of this wheel-performance variable.