Abstract: Apparatus and method for cleaning, rinsing and drying thin wafers such as silicon wafers or other disc-like substrates or elements wherein the wafers are rinsed in a hot water bath while supported in a conventional slotted carrier. The wafers are cleaned and rinsed while being moved through a planar beam of sonic energy in a water bath. Drying of the wafers is achieved by slowly raising the wafers out of the water bath such that the water surface tension at the surface of the water bath evenly and effectively draws off water from the rinsing surfaces of the wafers. A novel lift mechanism is provided for moving the wafers through the beam of sonic energy in the water bath and for slowly lifting the wafers and the cassette in independent movements through the surface of the water such that there is no contact between the wafers and the cassette or between the cassette and any other object at the point where the cassette and wafers move through the surface of the water.

Abstract: Apparatus and method for rinsing and drying thin wafers such as silicon wafers or other disc-like substrates or elements wherein the wafers are rinsed in a hot water bath while supported in a conventional slotted carrier. The wafers are dried by slowly, raising the wafers out of the water bath such that the water surface tension at the surface of the water bath evenly and effectively draws off water from the rising surfaces of the wafers. A novel lift mechanism is provided for slowly and independently lifting the wafers and the cassette in which the wafers were supported during rinsing through the surface of the water such that there is no contact between the wafers and the cassette or between the wafers and any other object or between the cassette and any other object at the point where the cassette and wafers move through the surface of the water.