Abstract: A thermal overload fuse (1) for fixation to a circuit substrate (17) comprising at least one spring arm (13) which is solderable, under fixed pre-stressed, to a contact location on the substrate, characterized in that the spring arm (13), which is fixed to an at least substantially planar frame part (2), adopts, in its relaxed state, a position which is spaced in a perpendicular direction relative to the substrate (17), in particular relative to the contact location (16); and in that the free end of the spring arm (13) is held down by at least one auxiliary web (7) onto the substrate (17), in particular onto the contact location (16); and in that the auxiliary web (7) is detachable from the frame part (2) along a predetermined line.

Abstract: A method of adjusting the values of resistors is described wherein regions of a resistive layer provided on a substrate are removed by means of a laser in dependence on the resistance that is required and/or by cutting marks of a specific shape into the resistive layer. In order to obtain resistors with values which are defined as accurately as possible, and which are free of disturbing inductivity, a point raster is formed in the resistive layer by means of single shots of the laser, with the extent and position of the raster, and/or the spacing between its individual points, and/or the size of the individual points being chosen in relation to the total area of the resistive layer in dependence on the required resistance and further physical values.