Abstract: In a device for separating a longitudinally-extended cylindrical workpiece, which has a diameter in the sub-millimeter range, into individual segments, the workpiece is guided in a clamping device. The clamping device includes a first and a second clamping jaw and a feed opening for the workpiece. The feed opening is fitted between the clamping jaws on the side facing the other clamping jaw and a longitudinal groove which defines a direction of advancement of the workpiece for receiving and guiding the workpiece between the clamping jaws. The clamping device has a passage for a laser beam and a cutting gas, which passage defines a working zone, disrupts the longitudinal groove and runs parallel thereto. A cutter head is arranged in the working zone and has an outlet opening for the laser beam and the cutting gas, which outlet opening is aligned with the passage.

Abstract: A device forms grooves or slits in a material web as it moves in a longitudinal direction. The grooves or slits, which are spaced apart from one another in the longitudinal direction, are formed by a laser beam. A laser beam source generates a continuous laser beam and a deflection mirror directs the laser beam onto the material web. The mirror rotates about an axis of rotation and it is displaceable along the axis. The mirror has a first mirror face, the line of intersection of which with a sectional plane perpendicular with respect to the axis of rotation forms a circular arc which varies depending on the axial position of the sectional plane. A second mirror face deflects the laser beam towards an absorber. Focusing optics focus the laser beam, after reflection from the first mirror face, onto the moving material web.

Abstract: In a device for separating a longitudinally-extended cylindrical workpiece, which has a diameter in the sub-millimeter range, into individual segments, the workpiece is guided in a clamping device. The clamping device includes a first and a second clamping jaw and a feed opening for the workpiece. The feed opening is fitted between the clamping jaws on the side facing the other clamping jaw and a longitudinal groove which defines a direction of advancement of the workpiece for receiving and guiding the workpiece between the clamping jaws. The clamping device has a passage for a laser beam and a cutting gas, which passage defines a working zone, disrupts the longitudinal groove and runs parallel thereto. A cutter head is arranged in the working zone and has an outlet opening for the laser beam and the cutting gas, which outlet opening is aligned with the passage.

Abstract: A device forms grooves or slits in a material web as it moves in a longitudinal direction. The grooves or slits, which are spaced apart from one another in the longitudinal direction, are formed by a laser beam. A laser beam source generates a continuous laser beam and a deflection mirror directs the laser beam onto the material web. The mirror rotates about an axis of rotation and it is displaceable along the axis. The mirror has a first mirror face, the line of intersection of which with a sectional plane perpendicular with respect to the axis of rotation forms a circular arc which varies depending on the axial position of the sectional plane. A second mirror face deflects the laser beam towards an absorber. Focusing optics focus the laser beam, after reflection from the first mirror face, onto the moving material web.

Abstract: Method for generating a laser pulse for the fine machining of workpieces using a fiber laser, the laser fiber of which is optically pumped by use of at least one diode laser which is operated by a current pulse whose slew rate, pulse height, and pulse length are adjusted in adaptation to the laser fiber in such a way that the laser pulse (22) is initially composed of a primary relaxation pulse (A), independently of the pulse length of the current pulse.

Abstract: In a method for separating silicon solar cells, a groove is introduced into a silicon wafer containing the silicon solar cells along a separating line in a front side of the silicon wafer adjacent to a p-n junction in the silicon wafer using a first laser beam. The groove has a depth reaching at least to the p-n junction and extends to a lateral edge of the silicon wafer. In a second work step, the silicon wafer is cut along the separating line starting at the lateral edge using a second laser beam directed into the groove. Wherein the melt arising during the cutting is driven out of the cutting kerf arising during the cutting using a cutting gas flowing at least approximately in the direction of the second laser beam.