Abstract: Disclosed is a wireless self-powered monolithic integrated capacitive sensor, as well as methods of manufacturing same. A single monolithic chip may include various technologies, including RF MEMS, CMOS devices and related circuitry, and physical sensor MEMS. An example pressure sensor is disclosed, including a sensing capacitor and a reference capacitor that together allow the system to provide steady output in various environmental conditions. In one embodiment a pre-fabricated circuit wafer is fusion bonded to a pre-fabricated diaphragm wafer. Doped silicon may form the monolithic structure to provide the voltage necessary to run the system.

Abstract: Micromachined flex interposers and methods of making the same are provided herein. More specifically the teachings herein are directed to interposer pins and strips having a rigid substrate supporting upper and lower cantilevered ends having a polyimide layer and a metal layer configured to flex towards the substrate layer during connection with upper and lower contact pads. Additional layers of polyimide and metal can be added to affect the flexibility and robustness of the pins and strips herein.

Abstract: Disclosed is a wireless self-powered monolithic integrated capacitive sensor, as well as methods of manufacturing same. A single monolithic chip may include various technologies, including RF MEMS, CMOS devices and related circuitry, and physical sensor MEMS. An example pressure sensor is disclosed, including a sensing capacitor and a reference capacitor that together allow the system to provide steady output in various environmental conditions. In one embodiment a pre-fabricated circuit wafer is fusion bonded to a pre-fabricated diaphragm wafer. Doped silicon may form the monolithic structure to provide the voltage necessary to run the system.