Abstract: Disclosed is a wireless self-powered monolithic integrated capacitive sensor, as well as methods of manufacturing same. A single monolithic chip may include various technologies, including RF MEMS, CMOS devices and related circuitry, and physical sensor MEMS. An example pressure sensor is disclosed, including a sensing capacitor and a reference capacitor that together allow the system to provide steady output in various environmental conditions. In one embodiment a pre-fabricated circuit wafer is fusion bonded to a pre-fabricated diaphragm wafer. Doped silicon may form the monolithic structure to provide the voltage necessary to run the system.

Abstract: Disclosed is a wireless self-powered monolithic integrated capacitive sensor, as well as methods of manufacturing same. A single monolithic chip may include various technologies, including RF MEMS, CMOS devices and related circuitry, and physical sensor MEMS. An example pressure sensor is disclosed, including a sensing capacitor and a reference capacitor that together allow the system to provide steady output in various environmental conditions. In one embodiment a pre-fabricated circuit wafer is fusion bonded to a pre-fabricated diaphragm wafer. Doped silicon may form the monolithic structure to provide the voltage necessary to run the system.