Patents Assigned to Rohinni, Inc.
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Patent number: 11967515Abstract: An apparatus for transferring a semiconductor die (“die”) from the first substrate to the second substrate. The apparatus includes a stage configured to hold a product substrate. A first bridge holds a transfer mechanism assembly. A second bridge holds a die substrate holder configured to hold the first substrate. A controller is configured to cause the first bridge and the second bridge to move to align the transfer mechanism assembly with the die on the first substrate with a transfer position on the second substrate where the die is to be transferred.Type: GrantFiled: March 21, 2022Date of Patent: April 23, 2024Assignee: Rohinni, Inc.Inventor: Andrew Huska
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Patent number: 11789196Abstract: An apparatus includes a first display, an indicium, and a second display. The second display can include a light-generating source deposited on a substrate. The second display illuminates the indicium and the second display has a thickness of less than 0.25 millimeters. The apparatus also includes one or more controllers communicatively coupled to the first display and the second display and configured to control states of the first display and the second display.Type: GrantFiled: November 18, 2020Date of Patent: October 17, 2023Assignee: Rohinni, Inc.Inventors: Cody Peterson, Andrew Huska
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Patent number: 11728189Abstract: An apparatus includes a transfer mechanism to transfer an electrically-actuatable element directly from a wafer tape to a transfer location on a circuit trace on a product substrate. The transfer mechanism includes one or more transfer wires. Two or more stabilizers disposed on either side of the one or more transfer wires. A needle actuator is connected to the one or more transfer wires and the two or more stabilizers to move the one or more transfer wires and the two or more stabilizers to a die transfer position.Type: GrantFiled: July 12, 2021Date of Patent: August 15, 2023Assignee: Rohinni, Inc.Inventors: Justin Wendt, Cody Peterson, Andrew Huska
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Patent number: 11728195Abstract: An apparatus for executing a direct transfer of a semiconductor device die from a first substrate to a second substrate. The apparatus includes a first substrate conveyance mechanism movable in two axes. A micro-adjustment mechanism is coupled with the first substrate conveyance mechanism and is configured to hold the first substrate and to make positional adjustments on a scale smaller than positional adjustments caused by the first substrate conveyance mechanism. The micro-adjustment mechanism includes a micro-adjustment actuator having a distal end and a first substrate holder frame that is movable via contact with the distal end of the micro-adjustment actuator. A second frame is configured to secure the second substrate such that a transfer surface is disposed facing the semiconductor device die disposed on a surface of the first substrate. A transfer mechanism is configured to press the semiconductor device die into contact with the transfer surface of the substrate.Type: GrantFiled: August 16, 2021Date of Patent: August 15, 2023Assignee: Rohinni, Inc.Inventors: Andrew Huska, Justin Wendt, Luke Dupin, Cody Peterson
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Patent number: 11562990Abstract: A system for performing a direct transfer of a semiconductor device die includes a first conveyance mechanism to convey a first substrate, and a second conveyance mechanism to convey a second substrate with respect to the first substrate. The first substrate includes a first side and a second side, and the semiconductor device die is disposed on the first side of the first substrate. The second conveyance mechanism includes a first portion and a second portion to clamp the second substrate adjacent to a first side of the first substrate. The first portion of the second conveyance mechanism has a concave shape and the second portion of the second conveyance mechanism has a convex counter shape corresponding to the concave shape of the first portion. The system also includes a transfer mechanism disposed adjacent to the first conveyance mechanism to effectuate the direct transfer.Type: GrantFiled: November 25, 2019Date of Patent: January 24, 2023Assignee: Rohinni, Inc.Inventors: Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow
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Patent number: 11488940Abstract: A method for transferring a plurality of die operatively associated with a transfer apparatus to a glass substrate to form a circuit component. The transfer occurs by positioning the glass substrate to face a first surface of a die carrier carrying multiple die. A reciprocating transfer member thrusts against a second surface of the die carrier to actuate the transfer member thereby causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position an initial die proximate to the glass substrate. The initial die transfers directly to a circuit trace on the glass substrate. At least one of the die carrier or the transfer member is then shifted such that the transfer member aligns with a subsequent die on the first surface of the die carrier. The acts of actuating, transferring, and shifting are repeated to effectuate a transfer of the multiple die onto the glass substrate.Type: GrantFiled: April 6, 2020Date of Patent: November 1, 2022Assignee: Rohinni, Inc.Inventors: Andrew Huska, Cody Peterson, Clinton Adams, Sean Kupcow
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Publication number: 20170328524Abstract: An apparatus includes a coverlay layer having a void therein. A backing layer is disposed against a first side of the coverlay layer. A transmission layer is disposed against a second side of the coverlay layer opposite the first side such that a chamber is formed within the void between the transmission layer and the backing layer. The transmission layer includes a first area having a first level of light transmissivity and a second area having a second level of light transmissivity that is greater than the first level of light transmissivity. The transmission layer is oriented so that at least a portion of each of the first area and the second area overlaps the void. A light source is positioned in the chamber between the first area of the transmission layer and the backing layer.Type: ApplicationFiled: May 13, 2016Publication date: November 16, 2017Applicant: Rohinni, Inc.Inventors: Cody Peterson, Monica Hansen, Justin Wendt, Clint Adams, Andy Huska