Patents Assigned to Rohinni, LLC
  • Electrophotographic deposition of unpackaged semiconductor device
    Patent number: 9502625
    Abstract: Described herein are techniques related a precision deposition of unpackaged semiconductor devices (“dies”) onto a substrate. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: November 22, 2016
    Assignee: Rohinni, LLC
    Inventors: Andrew Huska, Cody Peterson, Kasey Christie, Clint Adams, Orin Ozias