Patents Assigned to Rohm and Haas Electronic Chemicals, L.L.C.
  • Electronic device manufacture
    Publication number: 20040262751
    Abstract: Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated circuit assemblies.
    Type: Application
    Filed: April 2, 2004
    Publication date: December 30, 2004
    Applicant: Rohm and Haas Electronic Chemicals, L.L.C.
    Inventors: Angelo A. Lamola, Nathaniel E. Brese